AMD Xilinx
XC40110XV-09BG560I
XC40110XV-09BG560I ECAD Model
XC40110XV-09BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-09BG560I Datasheet Download
XC40110XV-09BG560I Overview
The XC40110XV-09BG560I chip model is a highly advanced and powerful integrated circuit designed for use in a variety of communication systems. It is a single-core, 32-bit processor with a frequency of up to 560 MHz and a wide range of features and capabilities. The design intention of this chip model was to provide a powerful, low-power solution for advanced communication systems.
The XC40110XV-09BG560I chip model is capable of supporting a wide range of communication protocols and applications. It is capable of supporting up to four channels of communication, with each channel capable of supporting up to four simultaneous users. It is also capable of supporting a variety of data transfer speeds, including high-speed Ethernet, USB, and Wi-Fi. In addition, it is capable of supporting a variety of security protocols, including WPA2, WPA3, and TLS.
The XC40110XV-09BG560I chip model is also capable of being upgraded in the future. It is capable of being upgraded to support higher speeds and more advanced security protocols. It is also capable of being upgraded to support additional features and applications. This makes it an ideal choice for use in advanced communication systems.
The XC40110XV-09BG560I chip model is also capable of being used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of robotics applications, including navigation, sensing, and control. It is also capable of supporting a variety of artificial intelligence algorithms and machine learning techniques. In order to use the XC40110XV-09BG560I chip model effectively, it is important to have a strong understanding of robotics, artificial intelligence, and machine learning.
In order to ensure the successful use of the XC40110XV-09BG560I chip model, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions associated with the chip model. This includes understanding the power requirements, the operating temperature, and the compatibility with other components. Additionally, it is important to understand the safety and security protocols that the chip model is capable of supporting.
Overall, the XC40110XV-09BG560I chip model is a powerful, low-power solution for advanced communication systems. It is capable of being upgraded in the future, and it can be used in the development and popularization of future intelligent robots. In order to use the XC40110XV-09BG560I chip model effectively, it is important to have a strong understanding of the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip model.
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