AMD Xilinx
XC40110XV-09BG560C
XC40110XV-09BG560C ECAD Model
XC40110XV-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-09BG560C Datasheet Download
XC40110XV-09BG560C Overview
The XC40110XV-09BG560C is a high-performance chip model that is suitable for a variety of applications, such as digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that can be used to design and develop complex digital systems.
The XC40110XV-09BG560C is a powerful chip model that can be used to create high-performance digital systems. It has a wide range of features, including high-speed operation, low power consumption, and a small form factor. The chip model also has a wide range of configurable options, allowing users to customize the system to their specific needs.
When using the XC40110XV-09BG560C, it is important to understand the product description and design requirements. This includes the power requirements, clock speeds, memory requirements, and other technical specifications. Additionally, it is important to understand the actual case studies and precautions that should be taken when designing and developing a system with the chip model.
The XC40110XV-09BG560C can be used in the development and popularization of future intelligent robots. This chip model has the ability to process large amounts of data quickly and accurately, making it an ideal choice for robotic applications. In order to use the chip model effectively, it is important to have a strong knowledge of the HDL language and the technical skills to design and develop complex digital systems. Additionally, it is important to have a good understanding of the product description and design requirements of the XC40110XV-09BG560C. With the right knowledge and skills, the XC40110XV-09BG560C can be used to create powerful and reliable intelligent robots.
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|---|---|---|
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