AMD Xilinx
XC40110XV-09BG432I
XC40110XV-09BG432I ECAD Model
XC40110XV-09BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-09BG432I Datasheet Download
XC40110XV-09BG432I Overview
The XC40110XV-09BG432I chip model is a powerful, versatile, and efficient integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is ideal for applications such as robotics, artificial intelligence (AI), and machine learning (ML). The chip model is programmed using the hardware description language (HDL).
The XC40110XV-09BG432I chip model offers several advantages that make it a suitable choice for various industries. It is highly reliable and efficient, with a low power consumption and high performance. It also supports a wide range of applications, from image processing to embedded computing. Its versatile design allows for easy customization and scalability, making it a cost-effective solution for many applications.
The XC40110XV-09BG432I chip model is expected to be in high demand in the coming years. With the rapid development of the robotics, AI, and ML industries, there is an increasing need for reliable, cost-effective, and powerful ICs. The XC40110XV-09BG432I chip model is well suited for these applications, and its versatility makes it a great choice for many different industries.
The XC40110XV-09BG432I chip model can be used to develop and popularize future intelligent robots. This chip model is ideal for robotics applications, as it offers a high level of efficiency and reliability. It is also easy to program using HDL, making it a great choice for robotics engineers and developers. In order to use the XC40110XV-09BG432I chip model effectively, technical talent such as robotics engineers, embedded systems engineers, and software engineers are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||