AMD Xilinx
XC40110XV-09BG432C
XC40110XV-09BG432C ECAD Model
XC40110XV-09BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-09BG432C Datasheet Download
XC40110XV-09BG432C Overview
The XC40110XV-09BG432C chip model is a highly sophisticated and powerful chip that is designed to meet the needs of a variety of industries. It is a powerful, efficient, and reliable chip that offers a wide range of features and functions. It is capable of handling complex tasks with ease and accuracy.
The XC40110XV-09BG432C chip model has several advantages over other models. It is designed to be highly efficient and reliable, offering superior performance and reliability at a lower cost. It is also designed to be highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
As the demand for high-performance chips continues to grow, the XC40110XV-09BG432C chip model is expected to become increasingly popular in the coming years. It is capable of handling complex tasks with ease, making it an ideal choice for a variety of applications. It is also highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
The XC40110XV-09BG432C chip model is designed to be highly compatible with a wide range of networks, making it an ideal choice for a variety of applications. It is capable of handling complex tasks with ease and accuracy. It is also designed to be highly reliable, offering superior performance and reliability at a lower cost.
The product description and specific design requirements of the XC40110XV-09BG432C chip model are designed to meet the needs of a variety of industries. It is designed to be highly efficient and reliable, offering superior performance and reliability at a lower cost. It is also designed to be highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
The XC40110XV-09BG432C chip model can be applied to a variety of intelligent scenarios, such as machine learning, artificial intelligence, and robotics. It is also capable of handling complex tasks with ease and accuracy, making it an ideal choice for a variety of applications. It is also highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
In the era of fully intelligent systems, the XC40110XV-09BG432C chip model is capable of handling complex tasks with ease and accuracy, making it an ideal choice for a variety of applications. It is also highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
In addition, the XC40110XV-09BG432C chip model is designed to meet the needs of a variety of industries. It is designed to be highly efficient and reliable, offering superior performance and reliability at a lower cost. It is also designed to be highly compatible with a wide range of networks, making it an ideal choice for a variety of applications.
When using the XC40110XV-09BG432C chip model, it is important to ensure that the chip is properly installed and configured. It is also important to ensure that the chip is compatible with the specific application or network it is being used for. Additionally, it is important to ensure that the chip is properly protected from any potential damage or interference.
In conclusion, the XC40110XV-09BG432C chip model is a highly sophisticated and powerful chip that is designed to meet the needs of a variety of industries. It is a powerful, efficient, and reliable chip that offers a wide range of features and functions. It is capable of handling complex tasks with ease and accuracy, making it an ideal choice for a variety of applications. It is also highly compatible with a wide range of networks, making it an ideal choice for a variety of applications. In the era of fully intelligent systems, the XC40110XV-09BG432C chip model is capable of handling complex tasks with ease and accuracy, making it an ideal choice for a variety of applications. When using the XC40110XV-09BG432C chip model, it is important to ensure that the chip is properly installed and configured, and that it is compatible with the specific application or network it is being used for.
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