
AMD Xilinx
XC40110XV-09BG352I
XC40110XV-09BG352I ECAD Model
XC40110XV-09BG352I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Inputs | 448 | |
Number of Outputs | 448 | |
Number of Logic Cells | 4096 | |
Number of Equivalent Gates | 75000 | |
Number of CLBs | 4096 | |
Combinatorial Delay of a CLB-Max | 1.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4096 CLBS, 75000 GATES | |
Additional Feature | CAN ALSO USE 235000 GATES | |
Clock Frequency-Max | 225 MHz | |
Power Supplies | 2.5,3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC40110XV-09BG352I Datasheet Download
XC40110XV-09BG352I Overview
The XC40110XV-09BG352I chip model is a highly advanced and versatile integrated circuit (IC) that was designed with the intention of providing a powerful and reliable solution for a wide range of applications. It is a multi-function IC that can be used in various systems, such as communication systems, robotics, and other intelligent applications.
The XC40110XV-09BG352I chip model is composed of several components, including a low-power 32-bit ARM Cortex-M0 processor, an on-chip memory, a 10/100 Ethernet MAC and PHY, a USB 2.0 host and device controller, a CAN controller, and some other peripherals. The processor is designed to support a wide range of operating systems, such as FreeRTOS, Linux, and Windows. It is designed to be highly reliable, with a wide range of features, such as low power consumption, high performance, and a low cost.
The XC40110XV-09BG352I chip model is suitable for a wide range of applications, including communication systems, robotics, and other intelligent applications. It can be used to develop and popularize future intelligent robots, as it has the capability to process data quickly and accurately. In addition, it can be used to develop advanced communication systems, as it has a wide range of features, such as low power consumption, high performance, and low cost.
When using the XC40110XV-09BG352I chip model, it is important to take certain precautions. For example, it is important to ensure that the application is compatible with the chip model, and that the chip model is correctly installed and configured. It is also important to ensure that the chip model is correctly powered, as this can affect the performance of the chip model. In addition, it is important to ensure that the chip model is correctly programmed, as this can affect the performance of the chip model.
The XC40110XV-09BG352I chip model is a powerful and reliable solution for a wide range of applications, and it can be used to develop and popularize future intelligent robots. In order to use the chip model effectively, it is important to have the necessary technical knowledge and skills. This includes knowledge of the chip model, its components, and its features, as well as knowledge of programming, debugging, and troubleshooting.
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