AMD Xilinx
XC40110XV-09BG352C
XC40110XV-09BG352C ECAD Model
XC40110XV-09BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 225 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-09BG352C Datasheet Download
XC40110XV-09BG352C Overview
The XC40110XV-09BG352C chip is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is an advanced chip that requires the use of HDL language for programming. This chip can be used in networks and intelligent scenarios, and it is suitable for the era of fully intelligent systems.
The XC40110XV-09BG352C chip is a powerful processor with a wide range of applications. It is capable of handling high-speed data processing, image processing, and other tasks. The chip is programmed using HDL language, which is a powerful language for embedded systems. The chip has a low power consumption and requires minimal external components for operation.
The product description of the XC40110XV-09BG352C chip includes its features and specifications. It has a 32-bit RISC processor core, which is capable of handling complex tasks. The chip also has a wide range of peripherals, including UART, I2C, SPI, and other interfaces. It has a wide range of memory options, including SRAM, ROM, and Flash. The chip also has a wide range of digital signal processing functions, including DSP, FFT, and other algorithms.
When designing with the XC40110XV-09BG352C chip, it is important to consider the power consumption and the physical size of the system. The chip has a low power consumption, but the size of the system should be taken into account when designing the system. It is also important to consider the software requirements of the system, as the chip is programmed using HDL language.
There are many case studies and examples of the XC40110XV-09BG352C chip being used in various applications. For example, it has been used in medical imaging systems, robotic systems, and other embedded applications. In addition, the chip has been used in various intelligent systems, such as autonomous vehicles, home automation, and other intelligent scenarios.
When using the XC40110XV-09BG352C chip, it is important to consider the power consumption and the physical size of the system. It is also important to consider the software requirements of the system, as the chip is programmed using HDL language. In addition, it is important to consider the safety requirements of the system, as the chip can be used in applications with sensitive data. Finally, it is important to consider the cost of the system, as the chip is relatively expensive.
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