AMD Xilinx
XC40110XV-08BG560I
XC40110XV-08BG560I ECAD Model
XC40110XV-08BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-08BG560I Datasheet Download
XC40110XV-08BG560I Overview
The XC40110XV-08BG560I chip model is a new development in the world of electronics, and it offers a number of advantages that make it an attractive option for many industries. This model is designed to be a multi-function, low-power, and highly integrated chip, making it ideal for a variety of applications. It is also designed to be highly reliable, with a wide range of features that make it suitable for a variety of tasks.
One of the key advantages of the XC40110XV-08BG560I chip model is its low-power consumption. This model has been designed to consume less power than other chip models, making it an attractive option for many industries that require a low-power solution. Additionally, the XC40110XV-08BG560I chip model is highly integrated, offering a range of features that make it suitable for a wide range of applications. This includes features such as integrated memory, high-speed data transfer, and a wide range of communication protocols.
The expected demand for the XC40110XV-08BG560I chip model is likely to continue to increase in the near future. This is due to its low-power consumption, high integration, and wide range of features. The chip model is also likely to be in demand in the development of intelligent robots, as the model is designed to be highly reliable and offers a wide range of features that make it suitable for a variety of tasks.
When considering the product description and specific design requirements of the XC40110XV-08BG560I chip model, it is important to understand that the model requires a certain level of expertise to use effectively. This includes knowledge of the chip's architecture, as well as the ability to program and debug the chip. Additionally, it is important to understand the different types of memory and communication protocols that the chip model supports, as well as any safety or reliability requirements that may be necessary.
In addition to the product description and specific design requirements, it is also important to consider actual case studies and precautions when using the XC40110XV-08BG560I chip model. This includes understanding the different types of applications that the chip model is suitable for, as well as any potential risks or issues that may arise when using the model. Additionally, it is important to understand any potential compatibility issues that may arise when using the chip model with other products or systems.
Overall, the XC40110XV-08BG560I chip model is a highly reliable and low-power solution that offers a wide range of features. It is an attractive option for many industries, and its expected demand is likely to continue to increase in the future. Additionally, the chip model is suitable for the development and popularization of future intelligent robots, and it requires a certain level of technical expertise to use effectively. With the right knowledge and understanding, the XC40110XV-08BG560I chip model can be a valuable tool in the development of new and innovative products and systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||