AMD Xilinx
XC40110XV-08BG560C
XC40110XV-08BG560C ECAD Model
XC40110XV-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-08BG560C Datasheet Download
XC40110XV-08BG560C Overview
The chip model XC40110XV-08BG560C is a new generation of chip technology that is revolutionizing the industry. It is an integrated circuit with a wide range of features and capabilities, making it one of the most advanced chips available in the market. This chip model is designed to provide superior performance in a wide range of applications, including digital signal processing, communications, and embedded systems.
The XC40110XV-08BG560C chip is designed with a variety of features that make it ideal for use in a variety of applications. It has a high-speed, low-power architecture that is capable of running multiple tasks simultaneously, making it suitable for use in networks and embedded systems. It also has a wide range of peripherals, including serial and parallel ports, USB, Ethernet, and other communication interfaces. Additionally, the chip is designed with a variety of security features, making it suitable for use in secure environments.
The XC40110XV-08BG560C chip is expected to be in high demand in the future, as it has the potential to be applied in a variety of applications. It is likely to be used in networks and embedded systems, as well as in intelligent systems. This chip can be used in communication networks, as it has the ability to support a wide range of protocols and technologies. Additionally, it can be used in intelligent systems, as it has the ability to process data quickly and accurately.
The XC40110XV-08BG560C chip is expected to be in high demand in the future, as it has the potential to be applied in a variety of scenarios. It can be used in communication networks, as it has the ability to support a wide range of protocols and technologies. Additionally, it can be used in intelligent systems, as it has the ability to process data quickly and accurately. This chip can also be used in the era of fully intelligent systems, as it has the ability to make decisions based on the data it receives.
The XC40110XV-08BG560C chip is a powerful and versatile chip that is expected to be in high demand in the future. It has the potential to be applied in a variety of applications, including communication networks, embedded systems, and intelligent systems. Additionally, it can be used in the era of fully intelligent systems, as it has the ability to make decisions based on the data it receives. This chip is expected to revolutionize the industry, and it is likely to become one of the most popular chips in the market.
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|---|---|---|
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