AMD Xilinx
XC40110XV-08BG432I
XC40110XV-08BG432I ECAD Model
XC40110XV-08BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-08BG432I Datasheet Download
XC40110XV-08BG432I Overview
The XC40110XV-08BG432I chip model is a highly advanced and reliable semiconductor device, developed by the leading technology company Xilinx. It is designed to provide a wide range of features and capabilities, and is suitable for many different types of applications. This chip model has been widely adopted by many industries, due to its high performance, low power consumption, and low cost.
The XC40110XV-08BG432I chip model has many advantages, such as its high speed and low power consumption. It is also highly reliable, and has been designed with advanced security features to ensure the safety of the data and applications. Furthermore, it has a wide range of applications, such as in networks, consumer electronics, and industrial automation.
The demand for the XC40110XV-08BG432I chip model is expected to increase in the coming years, as the technology continues to evolve and new applications are developed. It is likely that the chip model will be used in a wide range of applications, including the development of intelligent networks and scenarios. For example, it could be used in the development of autonomous vehicles, intelligent robots, and other intelligent systems.
The XC40110XV-08BG432I chip model is also suitable for use in the development and popularization of future intelligent robots. This chip model is capable of providing the necessary processing power and control capabilities for robots to perform complex tasks, such as object recognition and navigation. To use the chip model effectively, a variety of technical talents are needed, such as software engineers, electrical engineers, and robotics experts.
In conclusion, the XC40110XV-08BG432I chip model is a highly advanced and reliable semiconductor device, and its demand is expected to increase in the future. It is suitable for a wide range of applications, including the development of intelligent networks and scenarios, as well as the development and popularization of future intelligent robots. To use the chip model effectively, a variety of technical talents are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||