AMD Xilinx
XC40110XV-08BG432C
XC40110XV-08BG432C ECAD Model
XC40110XV-08BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-08BG432C Datasheet Download
XC40110XV-08BG432C Overview
The XC40110XV-08BG432C chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. Its key features include a high-speed, low-power, and low-cost design that is ideal for a variety of applications. It is capable of operating at speeds up to 8 GHz and is compatible with the HDL language.
The XC40110XV-08BG432C chip model offers a range of advantages, including a small footprint, low power consumption, and high performance. It is also highly reliable and cost-effective, making it an ideal choice for a wide range of applications. As more companies and organizations move towards digital transformation and the increased use of embedded systems, the demand for the XC40110XV-08BG432C chip model is expected to continue to grow in the future.
The XC40110XV-08BG432C chip model can be applied to various intelligent scenarios, such as network control, data analysis, and machine learning. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT) and Artificial Intelligence (AI). This chip model can help to improve the efficiency and accuracy of data processing, as well as reduce the cost of data analysis and machine learning.
In conclusion, the XC40110XV-08BG432C chip model is an ideal choice for digital signal processing, embedded processing, and image processing applications. It offers a range of advantages, such as a small footprint, low power consumption, and high performance. The demand for this chip model is expected to continue to grow in the future, and it can be applied to various intelligent scenarios, such as network control, data analysis, and machine learning. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT) and Artificial Intelligence (AI).
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||