AMD Xilinx
XC40110XV-08BG352C
XC40110XV-08BG352C ECAD Model
XC40110XV-08BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 258 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-08BG352C Datasheet Download
XC40110XV-08BG352C Overview
The XC40110XV-08BG352C is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is an innovative model that offers a wide range of features and capabilities. This model is designed to be used with HDL (Hardware Description Language) which makes it easier for engineers to program and design the chip.
The XC40110XV-08BG352C is a great choice for those who need a powerful chip model for their applications. This model has a variety of advantages that make it perfect for a wide range of applications. It has a high-performance processor that can handle complex tasks with ease. It also has a wide range of memory options, allowing users to customize their systems to their needs. Additionally, it has a built-in FPGA (Field Programmable Gate Array) which makes it easier to program and design the chip.
The XC40110XV-08BG352C is also a great choice for those who need a reliable and cost-effective chip model. This model is designed to be cost-effective while still providing a high level of performance. It is also designed to be reliable and has a low failure rate. This makes it a great choice for those who need a reliable chip model for their applications.
The demand for the XC40110XV-08BG352C is expected to increase in the future, as more and more applications are being developed that require this chip model. This chip model is perfect for those who need a powerful and reliable chip model for their applications. Additionally, the cost-effectiveness of the chip model makes it attractive for those who need a reliable and cost-effective chip model for their applications.
When designing a system that uses the XC40110XV-08BG352C, it is important to consider the design requirements of the chip model. This includes the power requirements, the memory requirements, the processor requirements, and the FPGA requirements. Additionally, it is important to consider the actual case studies and precautions when designing a system that uses this chip model. It is important to ensure that the system is designed correctly and that all of the components are compatible with one another.
Overall, the XC40110XV-08BG352C is a great choice for those who need a powerful and reliable chip model for their applications. This model is designed to be used with HDL, making it easier for engineers to program and design the chip. Additionally, the cost-effectiveness of the chip model makes it attractive for those who need a reliable and cost-effective chip model for their applications. Finally, it is important to consider the design requirements of the chip model, as well as actual case studies and precautions when designing a system that uses this chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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