AMD Xilinx
XC40110XV-07HQ240C
XC40110XV-07HQ240C ECAD Model
XC40110XV-07HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 296 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC40110XV-07HQ240C Datasheet Download
XC40110XV-07HQ240C Overview
The XC40110XV-07HQ240C is a powerful chip model that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be programmed using HDL language, which is a hardware description language. This makes it possible to create complex designs with a high degree of accuracy and precision.
The XC40110XV-07HQ240C offers a number of advantages over other chip models. It is highly efficient, with a power consumption that is much lower than other chips. It also has a large memory capacity, making it suitable for complex applications. Additionally, it has a high level of integration, which makes it possible to create more complex designs with fewer components.
The XC40110XV-07HQ240C is expected to be in high demand in the future. As technology advances, the need for high-performance chips will continue to grow. This chip model is well-suited for a variety of applications, which means that it will be in high demand in many industries. Additionally, as the demand for intelligent systems increases, the XC40110XV-07HQ240C will be in high demand in the network and intelligent system industries.
The XC40110XV-07HQ240C is well-suited for use in intelligent systems. It has a large memory capacity and a high level of integration, which makes it possible to create complex designs with fewer components. Additionally, its low power consumption makes it an ideal choice for intelligent systems. It is also capable of performing complex tasks quickly and efficiently, which makes it a great choice for intelligent systems.
The XC40110XV-07HQ240C is a powerful chip model that is well-suited for use in the era of fully intelligent systems. Its low power consumption, large memory capacity, and high level of integration make it an ideal choice for intelligent systems. Additionally, its ability to perform complex tasks quickly and efficiently makes it a great choice for intelligent systems. As technology advances and the demand for intelligent systems increases, the XC40110XV-07HQ240C is expected to be in high demand in the future.
You May Also Be Interested In
4,639 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||