AMD Xilinx
XC40110XV-07BG432C
XC40110XV-07BG432C ECAD Model
XC40110XV-07BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 4096 | |
| Number of Equivalent Gates | 75000 | |
| Number of CLBs | 4096 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4096 CLBS, 75000 GATES | |
| Additional Feature | CAN ALSO USE 235000 GATES | |
| Clock Frequency-Max | 296 MHz | |
| Power Supplies | 2.5,3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC40110XV-07BG432C Datasheet Download
XC40110XV-07BG432C Overview
The XC40110XV-07BG432C chip model is a highly advanced integrated circuit (IC) that offers a range of features and benefits for a variety of applications. This model is designed to meet the needs of a wide range of industries, from automotive to consumer electronics. It offers an array of features, including a low power consumption, high-speed processing, and a wide range of I/O capabilities. The chip is also designed for flexibility, allowing for easy integration into existing systems and applications.
The XC40110XV-07BG432C chip model is ideal for a range of applications, from industrial automation to consumer electronics. It offers a wide range of features, including a low power consumption, high-speed processing, and a wide range of I/O capabilities. It is also designed to be highly reliable and durable, with a high-temperature range and a wide range of operating voltages.
The demand for the XC40110XV-07BG432C chip model is expected to grow in the future, as more industries and applications begin to utilize its features and benefits. This chip model can be used in a variety of applications, such as automotive, consumer electronics, and industrial automation. It is also highly reliable and durable, making it an ideal choice for a wide range of applications.
When using the XC40110XV-07BG432C chip model, it is important to consider the product description and specific design requirements. This includes the power consumption, the operating voltage, and the temperature range. It is also important to consider the actual case studies and precautions when using the chip model.
The XC40110XV-07BG432C chip model can be used in the development and popularization of future intelligent robots. This chip model offers a range of features, including a low power consumption, high-speed processing, and a wide range of I/O capabilities. To use the chip model effectively, it is important to have the right technical talents and expertise. This includes knowledge of the product description and specific design requirements, as well as the actual case studies and precautions when using the chip model.
In conclusion, the XC40110XV-07BG432C chip model is an ideal choice for a wide range of applications. It offers a range of features and benefits, including a low power consumption, high-speed processing, and a wide range of I/O capabilities. It is also highly reliable and durable, making it an ideal choice for a variety of applications. The demand for this chip model is expected to grow in the future, as more industries and applications begin to utilize its features and benefits. Furthermore, the chip model can be used in the development and popularization of future intelligent robots, provided that the right technical talents and expertise are in place.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||