XC4010XL-3TQG176C
XC4010XL-3TQG176C
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rohs

AMD Xilinx

XC4010XL-3TQG176C


XC4010XL-3TQG176C
F20-XC4010XL-3TQG176C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LFQFP
LFQFP

XC4010XL-3TQG176C ECAD Model


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XC4010XL-3TQG176C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 7000
Number of CLBs 400
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 400 CLBS, 7000 GATES
Additional Feature MAX USABLE 10000 LOGIC GATES
Clock Frequency-Max 166 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G176
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 176
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 24 mm
Length 24 mm
Seated Height-Max 1.6 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description LFQFP,
Pin Count 176
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4010XL-3TQG176C Datasheet Download


XC4010XL-3TQG176C Overview



The XC4010XL-3TQG176C chip model is a powerful application processor that is suitable for a variety of high-performance digital signal processing, embedded processing, and image processing tasks. It requires the use of HDL (Hardware Description Language) for programming, enabling a wide range of applications and performance levels.


The XC4010XL-3TQG176C chip model has several advantages over other models. It features a high-performance processor core with a wide range of peripheral options, allowing it to be used in a variety of applications. It also has an integrated memory controller and a wide range of I/O options, making it well-suited for a variety of embedded applications. Additionally, it has a low power consumption and a wide temperature range, making it suitable for use in a variety of environments.


The XC4010XL-3TQG176C chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is also expected to be used in a variety of industries, from consumer electronics to automotive, medical, and industrial applications. As new technologies emerge, the XC4010XL-3TQG176C chip model may be able to take advantage of them, allowing for even more powerful applications.


In conclusion, the XC4010XL-3TQG176C chip model is a powerful and versatile processor that is suitable for a variety of applications. It has a wide range of peripheral options, a low power consumption, and a wide temperature range, making it suitable for a variety of environments. It is expected to be in high demand in the future, as it is well-suited for a variety of applications in a variety of industries. As new technologies emerge, the XC4010XL-3TQG176C chip model may be able to take advantage of them, allowing for even more powerful applications.



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