
AMD Xilinx
XC4010XL-3TQG176C
XC4010XL-3TQG176C ECAD Model
XC4010XL-3TQG176C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 7000 | |
Number of CLBs | 400 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 400 CLBS, 7000 GATES | |
Additional Feature | MAX USABLE 10000 LOGIC GATES | |
Clock Frequency-Max | 166 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G176 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 176 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 24 mm | |
Length | 24 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 176 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4010XL-3TQG176C Datasheet Download
XC4010XL-3TQG176C Overview
The XC4010XL-3TQG176C chip model is a powerful application processor that is suitable for a variety of high-performance digital signal processing, embedded processing, and image processing tasks. It requires the use of HDL (Hardware Description Language) for programming, enabling a wide range of applications and performance levels.
The XC4010XL-3TQG176C chip model has several advantages over other models. It features a high-performance processor core with a wide range of peripheral options, allowing it to be used in a variety of applications. It also has an integrated memory controller and a wide range of I/O options, making it well-suited for a variety of embedded applications. Additionally, it has a low power consumption and a wide temperature range, making it suitable for use in a variety of environments.
The XC4010XL-3TQG176C chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is also expected to be used in a variety of industries, from consumer electronics to automotive, medical, and industrial applications. As new technologies emerge, the XC4010XL-3TQG176C chip model may be able to take advantage of them, allowing for even more powerful applications.
In conclusion, the XC4010XL-3TQG176C chip model is a powerful and versatile processor that is suitable for a variety of applications. It has a wide range of peripheral options, a low power consumption, and a wide temperature range, making it suitable for a variety of environments. It is expected to be in high demand in the future, as it is well-suited for a variety of applications in a variety of industries. As new technologies emerge, the XC4010XL-3TQG176C chip model may be able to take advantage of them, allowing for even more powerful applications.
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