AMD Xilinx
XC4010XL-1TQG144I
XC4010XL-1TQG144I ECAD Model
XC4010XL-1TQG144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAX USABLE 10000 LOGIC GATES | |
| Clock Frequency-Max | 200 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4010XL-1TQG144I Datasheet Download
XC4010XL-1TQG144I Overview
The XC4010XL-1TQG144I chip model is a powerful and reliable chip that can be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip is designed to meet the needs of a wide range of industries, including communication systems, medical systems, automotive systems, and more.
The XC4010XL-1TQG144I chip model is designed to provide the highest level of performance and reliability. It is designed to be able to handle complex tasks and to be able to handle high-speed data processing. It is also designed to be able to handle a variety of different types of data, including audio, video, and image processing. This chip is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The XC4010XL-1TQG144I chip model is designed to be able to handle a variety of different types of applications. It is designed to be able to handle applications such as medical imaging, automotive systems, and more. It is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The XC4010XL-1TQG144I chip model is designed to be able to handle a variety of different types of applications. It is designed to be able to handle high-performance digital signal processing, embedded processing, image processing, and more. This chip is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The XC4010XL-1TQG144I chip model is designed to be able to handle a variety of different types of applications. It is designed to be able to handle high-performance digital signal processing, embedded processing, image processing, and more. This chip is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The XC4010XL-1TQG144I chip model is designed to be able to handle a variety of different types of applications. It is designed to be able to handle complex tasks and to be able to handle high-speed data processing. It is also designed to be able to handle a variety of different types of data, including audio, video, and image processing. This chip is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The original design intention of the XC4010XL-1TQG144I chip model was to provide a reliable and powerful chip that can be used in a variety of applications. It is designed to be able to handle complex tasks and to be able to handle high-speed data processing. It is also designed to be able to handle a variety of different types of data, including audio, video, and image processing. This chip is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks.
The future development of the XC4010XL-1TQG144I chip model and related industries will depend on what specific technologies are needed. It is possible that the application environment may require the support of new technologies, such as 5G or AI, in order to keep up with the industry trends. It is also possible that the chip model could be upgraded in order to be able to handle more complex tasks or to be able to handle higher speed data processing.
The XC4010XL-1TQG144I chip model is designed to be able to handle a variety of different types of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is also designed to be able to handle a variety of different types of communication protocols, including Wi-Fi, Bluetooth, and cellular networks. This chip model is also designed to be able to handle advanced communication systems, making it a great choice for a variety of applications.
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