AMD Xilinx
XC4010E-3PQG160C
XC4010E-3PQG160C ECAD Model
XC4010E-3PQG160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAX USABLE 10000 LOGIC GATES | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 160 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4010E-3PQG160C Datasheet Download
XC4010E-3PQG160C Overview
The Xilinx XC4010E-3PQG160C chip model is a highly advanced semiconductor device that offers a wide range of features and capabilities. This model is ideal for a variety of applications, including high-speed networking, multimedia, and embedded systems. It is designed to be used in the most demanding and complex environments, providing superior performance and reliability.
The XC4010E-3PQG160C chip model offers several advantages over other models. It has a highly efficient design that provides improved power and thermal management, which helps reduce energy consumption and extend the life of the device. Additionally, the device is designed to be compatible with a variety of industry-standard interfaces and protocols, allowing for easy integration into existing systems. The device also has a wide range of features that can be used to customize the system for specific applications, such as security and encryption.
The XC4010E-3PQG160C chip model is expected to be in high demand in the coming years as the need for faster, more reliable networks continues to grow. This model is ideal for applications such as high-speed wireless networks, home and business networks, and industrial systems. Additionally, the device can be used in intelligent scenarios, such as artificial intelligence, machine learning, and autonomous systems. It is also well-suited for use in the era of fully intelligent systems, as it is capable of handling complex tasks and data processing.
The XC4010E-3PQG160C chip model has a wide range of features and capabilities. It is designed with a high-speed, low-power architecture that allows for faster data processing and improved performance. Additionally, the device is designed to be compatible with a variety of industry-standard protocols and interfaces, providing compatibility with existing systems. The device also has a wide range of features that can be used to customize the system for specific applications, such as security and encryption.
When designing with the XC4010E-3PQG160C chip model, it is important to consider the specific design requirements of the system. This includes factors such as power requirements, thermal management, and compatibility with existing systems. Additionally, it is important to consider the actual case studies and precautions for using the device. This includes factors such as the proper placement of the device, the use of appropriate cooling systems, and any potential risks associated with using the device.
Overall, the XC4010E-3PQG160C chip model is a highly advanced semiconductor device that offers a wide range of features and capabilities. It is expected to be in high demand in the coming years as the need for faster, more reliable networks continues to grow. Additionally, the device can be used in intelligent scenarios, such as artificial intelligence, machine learning, and autonomous systems. When designing with the XC4010E-3PQG160C chip model, it is important to consider the specific design requirements of the system, as well as the actual case studies and precautions for using the device.
You May Also Be Interested In
4,819 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66.9600 | $66.9600 |
| 10+ | $66.2400 | $662.4000 |
| 100+ | $62.6400 | $6,264.0000 |
| 1000+ | $59.0400 | $29,520.0000 |
| 10000+ | $54.0000 | $54,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||