AMD Xilinx
XC4010E-1BGG225C
XC4010E-1BGG225C ECAD Model
XC4010E-1BGG225C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 7000 | |
| Number of CLBs | 400 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 400 CLBS, 7000 GATES | |
| Additional Feature | MAX USABLE 10000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PBGA-B225 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 225 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 225 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4010E-1BGG225C Datasheet Download
XC4010E-1BGG225C Overview
The XC4010E-1BGG225C chip model is a highly advanced chip specifically designed for high-performance digital signal processing, embedded processing, and image processing. It is suitable for a wide range of applications, including the development of intelligent systems, embedded systems, and image processing.
The XC4010E-1BGG225C chip model is designed to be used with the HDL language, or hardware description language. This language is used to create a hardware description of the chip, which is then used to create the actual chip. This language is used to create a hardware description of the chip, which is then used to create the actual chip. This language is used to create a hardware description of the chip, which is then used to create the actual chip.
The XC4010E-1BGG225C chip model has the potential to be used in a variety of intelligent scenarios, such as the development of networks and the advancement of the Internet of Things (IoT). It can be used in the development of autonomous systems, such as self-driving cars, as well as in the development of intelligent systems, such as intelligent robots. It can also be used in the development of image processing systems, such as facial recognition and object detection.
The product description and specific design requirements of the XC4010E-1BGG225C chip model can be found in its datasheet. This datasheet includes detailed information about the chip, including its power consumption, clock speed, and memory size. It also includes information about the chip's input and output pins, as well as its instruction set.
In addition to the datasheet, there are several case studies and tutorials available online that can help designers better understand the XC4010E-1BGG225C chip model. These case studies and tutorials can provide valuable insight into the design and implementation of the chip model.
When designing with the XC4010E-1BGG225C chip model, it is important to keep in mind that the chip model is designed for high-performance digital signal processing, embedded processing, and image processing. Care should be taken to ensure that the chip is not overloaded with unnecessary tasks, as this can lead to decreased performance. Additionally, the chip should be used in accordance with the manufacturer's instructions and specifications in order to ensure optimal performance.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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