XC4010D-5BG225C
XC4010D-5BG225C
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rohs

AMD Xilinx

XC4010D-5BG225C


XC4010D-5BG225C
F20-XC4010D-5BG225C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC4010D-5BG225C ECAD Model


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XC4010D-5BG225C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 160
Number of Outputs 160
Number of Logic Cells 400
Number of Equivalent Gates 8000
Number of CLBs 400
Combinatorial Delay of a CLB-Max 4.5 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 400 CLBS, 8000 GATES
Additional Feature 1120 FLIP-FLOPS; TYP. GATES = 8000-10000
Clock Frequency-Max 133.3 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.165 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4010D-5BG225C Datasheet Download


XC4010D-5BG225C Overview



The XC4010D-5BG225C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed for a variety of applications, such as medical imaging, automotive, industrial automation, and aerospace. It is capable of providing high-speed, low-power, and high-accuracy processing.


The XC4010D-5BG225C chip model is based on the Xilinx Virtex-4 FPGA architecture and it requires the use of the hardware description language (HDL) to program it. It is designed to be used in applications that require high-speed, low-power, and high-accuracy processing. It has a wide range of features and capabilities, including a large number of memory blocks, high-speed serial transceivers, and a wide range of I/O options. It also offers a flexible design platform with a variety of development tools and libraries.


The XC4010D-5BG225C chip model is well-suited for a variety of applications, including medical imaging, automotive, industrial automation, and aerospace. It is capable of providing high-speed, low-power, and high-accuracy processing. It is also suitable for the development and popularization of future intelligent robots. To effectively use the XC4010D-5BG225C chip model, technical talents with a good understanding of HDL programming and logic design are needed.


When designing with the XC4010D-5BG225C chip model, it is important to consider the specific design requirements and product description. It is also important to consider the actual case studies and precautions that should be taken. For example, when designing a system with the XC4010D-5BG225C chip model, it is important to consider the power budget and the thermal budget. Additionally, it is important to consider the timing and routing constraints, as well as the clock skew and the power supply noise.


Overall, the XC4010D-5BG225C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is suitable for a variety of applications, including medical imaging, automotive, industrial automation, and aerospace. It is also suitable for the development and popularization of future intelligent robots. To effectively use the XC4010D-5BG225C chip model, technical talents with a good understanding of HDL programming and logic design are needed.



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