AMD Xilinx
XC4006E-2PQG160C
XC4006E-2PQG160C ECAD Model
XC4006E-2PQG160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 4000 | |
| Number of CLBs | 256 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 256 CLBS, 4000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 160 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4006E-2PQG160C Datasheet Download
XC4006E-2PQG160C Overview
The XC4006E-2PQG160C chip model is an advanced integrated circuit designed by Xilinx, Inc. It is a field-programmable gate array (FPGA) with a wide range of features and capabilities. It is designed to meet the needs of high-performance applications in the areas of data processing, communications, and networking.
The XC4006E-2PQG160C chip model is designed to offer high speed and performance, low power consumption, and reliable operation. It is capable of supporting up to 2 million logic elements, 160Kb of configurable RAM, and over 3,000 I/Os. This chip model also features a low-power, low-noise design, making it suitable for use in advanced communication systems.
In terms of its original design intention, the XC4006E-2PQG160C chip model was designed to be flexible and upgradeable. It is capable of being reconfigured to meet the requirements of different applications, and can be adapted to support new technologies. This allows for the chip model to be used in different scenarios and applications, making it a versatile and powerful choice for a wide range of projects.
The XC4006E-2PQG160C chip model is also suitable for use in advanced communication systems, such as 5G wireless networks. It is capable of providing the high speed and performance required by modern networks, and its low-power design makes it suitable for use in mobile applications. Additionally, the chip model can be used in intelligent scenarios, such as edge computing and machine learning.
In terms of product description and specific design requirements, the XC4006E-2PQG160C chip model is designed to be a flexible, high-performance FPGA. It is capable of supporting up to 2 million logic elements, 160Kb of configurable RAM, and over 3,000 I/Os. Additionally, the chip model is designed to be low-power and low-noise, making it suitable for use in advanced communication systems.
When using the XC4006E-2PQG160C chip model, there are a few important considerations to keep in mind. It is important to ensure that the chip model is properly configured and programmed to meet the specific requirements of the application. Additionally, it is important to ensure that the chip model is compatible with the other components in the system, such as the power supply and memory.
In conclusion, the XC4006E-2PQG160C chip model is a powerful and versatile integrated circuit designed by Xilinx, Inc. It is designed to meet the needs of high-performance applications in the areas of data processing, communications, and networking. It is capable of being reconfigured and upgraded to meet the requirements of different applications, and can be used in advanced communication systems and intelligent scenarios. When using the chip model, it is important to ensure that it is properly configured and programmed, and that it is compatible with the other components in the system.
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1,874 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $69.3628 | $69.3628 |
| 10+ | $68.6170 | $686.1700 |
| 100+ | $64.8878 | $6,488.7819 |
| 1000+ | $61.1586 | $30,579.3170 |
| 10000+ | $55.9378 | $55,937.7750 |
| The price is for reference only, please refer to the actual quotation! | ||