AMD Xilinx
XC4006-6PQ160I
XC4006-6PQ160I ECAD Model
XC4006-6PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 128 | |
| Number of Outputs | 128 | |
| Number of Logic Cells | 608 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 256 | |
| Combinatorial Delay of a CLB-Max | 6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 256 CLBS, 5000 GATES | |
| Additional Feature | 768 FLIP-FLOPS; TYP. GATES = 5000-6000 | |
| Clock Frequency-Max | 90.9 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4006-6PQ160I Datasheet Download
XC4006-6PQ160I Overview
The chip model XC4006-6PQ160I is a high-end, high-performance chip model developed by a leading semiconductor company. It is designed to meet the needs of the most demanding applications. It has a wide range of features and functions, including support for a variety of communication protocols, high-speed data processing, and advanced security features.
The XC4006-6PQ160I chip model is suitable for a range of applications, from consumer electronics, to industrial automation, to cloud computing. It is also suitable for applications that require low power consumption and high performance, such as Internet of Things (IoT) devices. The chip model is also suitable for applications that require a high degree of scalability and flexibility, such as AI and Machine Learning (ML) applications.
In terms of industry trends, the XC4006-6PQ160I chip model has seen increasing demand in recent years. This is due to the high performance, low power consumption, and flexibility of the chip model. Additionally, the chip model is an ideal choice for applications that require support for a variety of communication protocols, such as Bluetooth, Wi-Fi, and Zigbee.
In terms of design requirements, the XC4006-6PQ160I chip model is designed to meet the needs of the most demanding applications. It has a wide range of features and functions, including support for a variety of communication protocols, high-speed data processing, and advanced security features. Additionally, the chip model is designed to be highly scalable and flexible, allowing for easy integration into existing systems.
In terms of future development, the XC4006-6PQ160I chip model is expected to continue to see increased demand in related industries. This is due to the chip model's ability to meet the needs of a wide range of applications, from consumer electronics, to industrial automation, to cloud computing. Additionally, the chip model is expected to become increasingly more powerful and versatile, as new technologies and applications are developed.
In terms of application environment requirements, the XC4006-6PQ160I chip model is designed to meet the needs of the most demanding applications. It is designed to be highly scalable and flexible, allowing for easy integration into existing systems. Additionally, the chip model is designed to support a variety of communication protocols, including Bluetooth, Wi-Fi, and Zigbee.
In conclusion, the XC4006-6PQ160I chip model is a high-end, high-performance chip model developed by a leading semiconductor company. It is designed to meet the needs of the most demanding applications, including support for a variety of communication protocols, high-speed data processing, and advanced security features. Additionally, the chip model is expected to continue to see increased demand in related industries, as new technologies and applications are developed. The chip model is also designed to be highly scalable and flexible, allowing for easy integration into existing systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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