AMD Xilinx
XC4005H-5PG223C
XC4005H-5PG223C ECAD Model
XC4005H-5PG223C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 190 | |
| Number of Outputs | 190 | |
| Number of Logic Cells | 466 | |
| Number of Equivalent Gates | 4000 | |
| Number of CLBs | 196 | |
| Combinatorial Delay of a CLB-Max | 4.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 196 CLBS, 4000 GATES | |
| Additional Feature | 392 FLIP-FLOPS; TYP. GATES = 4000-5000 | |
| Clock Frequency-Max | 133.3 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P223 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 223 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA223,18X18 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 47.244 mm | |
| Length | 47.244 mm | |
| Seated Height-Max | 4.064 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA223,18X18 | |
| Pin Count | 223 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4005H-5PG223C Datasheet Download
XC4005H-5PG223C Overview
The XC4005H-5PG223C chip model is a powerful tool for advanced communication systems, offering a range of benefits and potential applications. Developed by Xilinx, the chip model is designed to provide a high-performance, low-power solution for a variety of applications. It is a single-chip solution that integrates multiple functions, such as a programmable logic device, a processor, and a memory controller, into a single package.
The XC4005H-5PG223C chip model is capable of supporting multiple communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and USB. It also offers a wide range of features, including high-speed data transfer, low latency, and low power consumption. The chip model is also designed to be compatible with a variety of operating systems, such as Linux, Windows, and Android.
The XC4005H-5PG223C chip model is expected to be in high demand in the coming years, as the demand for advanced communication systems increases. As the technology continues to evolve, the chip model will be able to support more advanced applications, such as the Internet of Things (IoT). It is also expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, smart home systems, and smart city systems.
The XC4005H-5PG223C chip model is designed with the potential for future upgrades in mind. It is capable of supporting advanced communication protocols and features, such as 5G, as well as new technologies, such as artificial intelligence (AI) and machine learning. This means that the chip model can be used in the era of fully intelligent systems, allowing for the development of advanced applications and solutions.
In conclusion, the XC4005H-5PG223C chip model is an ideal solution for a variety of communication systems. It offers a range of features and benefits, including high-speed data transfer, low latency, low power consumption, and compatibility with a variety of operating systems. It is also designed with the potential for future upgrades in mind, making it suitable for use in the era of fully intelligent systems. As the demand for advanced communication systems continues to grow, the XC4005H-5PG223C chip model is expected to be in high demand in the coming years.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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