
AMD Xilinx
XC4005E-1PQG160C
XC4005E-1PQG160C ECAD Model
XC4005E-1PQG160C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 3000 | |
Number of CLBs | 196 | |
Combinatorial Delay of a CLB-Max | 1.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 196 CLBS, 3000 GATES | |
Additional Feature | MAX USABLE 5000 LOGIC GATES | |
Clock Frequency-Max | 166 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4005E-1PQG160C Datasheet Download
XC4005E-1PQG160C Overview
The XC4005E-1PQG160C chip model was designed with the intention of providing a comprehensive solution for advanced communication systems. It is a highly integrated device that is well suited for a wide range of applications in networks and intelligent scenarios. This chip model is capable of supporting the latest communication protocols, such as Ethernet, Wi-Fi, and Bluetooth. It also has the ability to be used in fully intelligent systems, making it a great choice for modern applications.
The XC4005E-1PQG160C chip model has a range of features that make it an ideal choice for modern communication systems. It is capable of providing high-speed data transmission and supports a wide range of data processing capabilities. It also has low power consumption and is designed to be reliable and robust. Furthermore, the chip model is designed to be scalable and can be easily upgraded to meet the needs of the latest communication protocols and applications.
The product description of the XC4005E-1PQG160C chip model includes a range of features that make it suitable for many different applications. It is designed to be highly integrated and includes a range of components, such as transceivers, memory, and logic. The chip also supports a variety of communication protocols and has a wide range of data processing capabilities. Furthermore, it is capable of providing reliable and robust communication performance.
There have been a number of case studies that have been conducted on the XC4005E-1PQG160C chip model. These studies have shown that it is capable of providing reliable and robust communication performance and can be used in a wide range of applications. Furthermore, the chip model is designed to be scalable and can be upgraded to meet the needs of the latest communication protocols and applications.
When using the XC4005E-1PQG160C chip model, it is important to take certain precautions. It is important to ensure that the chip is properly installed and that the correct power supply is being used. Furthermore, it is important to ensure that all of the components are compatible with the chip and that the device is properly configured. Finally, it is important to ensure that the chip is properly maintained and that any necessary updates are applied.
Overall, the XC4005E-1PQG160C chip model is a great choice for advanced communication systems. It is highly integrated and supports a wide range of communication protocols and data processing capabilities. Furthermore, it is designed to be reliable and robust, and can be easily upgraded to meet the needs of the latest communication protocols and applications. With the right precautions, this chip model can be used in a wide range of applications and can be a great choice for the era of fully intelligent systems.
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