
AMD Xilinx
XC4003H-4PQ208C
XC4003H-4PQ208C ECAD Model
XC4003H-4PQ208C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 160 | |
Number of Outputs | 160 | |
Number of Logic Cells | 238 | |
Number of Equivalent Gates | 2500 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 4 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 2500 GATES | |
Additional Feature | MAX. 160 I/OS; 200 FLIP-FLOPS; TYP. GATES = 2500 - 3000 | |
Clock Frequency-Max | 133.3 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 3.92 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-208 | |
Pin Count | 208 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC4003H-4PQ208C Datasheet Download
XC4003H-4PQ208C Overview
The chip model XC4003H-4PQ208C is a cutting-edge technology, developed by a leading semiconductor manufacturer, that provides a powerful platform for a variety of applications. It is designed to provide users with an efficient and reliable performance, as well as a wide range of features and benefits. The chip model is designed to be compatible with a variety of operating systems and is suitable for use in a wide range of industries.
The XC4003H-4PQ208C chip model provides a number of advantages, such as high performance, low power consumption, and high integration. It is also designed to be highly reliable and secure, making it an ideal choice for applications in the industrial and commercial sectors. The chip model is also designed to be easily upgradable, allowing users to easily add new features and capabilities to their devices.
The chip model XC4003H-4PQ208C is expected to be in high demand in the near future, as the need for efficient and reliable technology continues to grow. The chip model is expected to be an important component in the development and popularization of intelligent robots, as it provides the necessary computing power and features to enable the development of sophisticated robots. The chip model also provides a platform for a variety of applications, such as medical, industrial, and consumer electronics.
In order to use the chip model XC4003H-4PQ208C effectively, technical personnel with a high level of expertise in semiconductor technology, computer engineering, and robotics are needed. The chip model requires a deep understanding of the underlying technology and its applications, as well as the ability to apply the model in various contexts. Additionally, the chip model requires the user to be familiar with the various operating systems and platforms that it is compatible with.
In conclusion, the chip model XC4003H-4PQ208C is a cutting-edge technology that provides users with a powerful platform for a variety of applications. It is expected to be in high demand in the near future, as the need for efficient and reliable technology continues to grow. The chip model is also expected to be an important component in the development and popularization of intelligent robots, as it provides the necessary computing power and features to enable the development of sophisticated robots. In order to use the chip model effectively, technical personnel with a high level of expertise in semiconductor technology, computer engineering, and robotics are needed.
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