AMD Xilinx
XC4003E-3PQG100C
XC4003E-3PQG100C ECAD Model
XC4003E-3PQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 100 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4003E-3PQG100C Datasheet Download
XC4003E-3PQG100C Overview
The chip model XC4003E-3PQG100C is a powerful and versatile model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language for programming and implementation. The chip model is designed to meet the needs of the current industry trends, and is capable of providing reliable performance for a wide range of applications.
The chip model XC4003E-3PQG100C is capable of handling complex tasks such as image processing and embedded processing. It can be used in a variety of scenarios, such as network applications, intelligent scenarios, and fully intelligent systems. The chip model is designed to be able to support the latest technologies and is capable of providing the best performance possible.
The chip model XC4003E-3PQG100C is a powerful and versatile model that can be used in a variety of applications. It is capable of providing reliable performance for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. The chip model is designed to meet the needs of the current industry trends, and is capable of providing reliable performance for a wide range of applications.
The chip model XC4003E-3PQG100C is capable of handling complex tasks such as image processing and embedded processing, and can be used in a variety of scenarios, such as network applications, intelligent scenarios, and fully intelligent systems. The chip model is designed to be able to support the latest technologies and is capable of providing the best performance possible.
The chip model XC4003E-3PQG100C is capable of providing reliable performance for a wide range of applications, and is designed to meet the needs of the current industry trends. The chip model is capable of providing reliable performance for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. The chip model is also capable of handling complex tasks such as image processing and embedded processing, and can be used in a variety of scenarios, such as network applications, intelligent scenarios, and fully intelligent systems.
The chip model XC4003E-3PQG100C is designed to be able to support the latest technologies and is capable of providing the best performance possible. The chip model is also capable of handling complex tasks such as image processing and embedded processing, and can be used in a variety of scenarios, such as network applications, intelligent scenarios, and fully intelligent systems. The future applications of the chip model XC4003E-3PQG100C in networks and the intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems, will depend on what specific technologies are needed.
In conclusion, the chip model XC4003E-3PQG100C is a powerful and versatile model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language for programming and implementation. The chip model is designed to meet the needs of the current industry trends, and is capable of providing reliable performance for a wide range of applications. It is also capable of handling complex tasks such as image processing and embedded processing, and can be used in a variety of scenarios, such as network applications, intelligent scenarios, and fully intelligent systems. The future applications of the chip model XC4003E-3PQG100C in networks and the intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems, will depend on what specific technologies are needed.
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5,837 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26.6844 | $26.6844 |
| 10+ | $26.3975 | $263.9747 |
| 100+ | $24.9628 | $2,496.2823 |
| 1000+ | $23.5282 | $11,764.0890 |
| 10000+ | $21.5197 | $21,519.6750 |
| The price is for reference only, please refer to the actual quotation! | ||