AMD Xilinx
XC4003E-2VQG100C
XC4003E-2VQG100C ECAD Model
XC4003E-2VQG100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4003E-2VQG100C Datasheet Download
XC4003E-2VQG100C Overview
The XC4003E-2VQG100C chip model is a highly advanced, versatile integrated circuit that has been designed to meet the needs of the modern communication systems. It is a high-performance, low-power, multi-function device that can be used in a wide range of applications.
The XC4003E-2VQG100C chip model was designed with the intention of offering a reliable, cost-effective, and easy-to-use solution for communication systems. It is equipped with a wide range of features, such as high-speed data transfer, low-power consumption, and high-speed signal processing. It also supports a variety of communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and others.
The XC4003E-2VQG100C chip model is capable of being upgraded in the future to meet the ever-changing needs of the communication systems. It is also capable of being used in advanced communication systems, such as 5G networks, and can be applied to intelligent scenarios, such as smart homes, intelligent transportation, and more.
In order to ensure that the XC4003E-2VQG100C chip model meets the requirements of the communication systems, it is important to understand the product description and specific design requirements. This includes the operating temperature range, power supply requirements, signal processing capabilities, and other related parameters. It is also important to consider the actual case studies and precautions associated with the use of the chip model.
Overall, the XC4003E-2VQG100C chip model is a highly advanced, reliable, and cost-effective solution for communication systems. It is capable of being upgraded in the future to meet the ever-changing needs of the communication systems, and can be applied to intelligent scenarios, such as 5G networks, smart homes, and intelligent transportation. By understanding the product description and specific design requirements, as well as actual case studies and precautions, it is possible to ensure that the chip model meets the requirements of the communication systems.
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4,705 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $32.5787 | $32.5787 |
| 10+ | $32.2284 | $322.2843 |
| 100+ | $30.4769 | $3,047.6883 |
| 1000+ | $28.7253 | $14,362.6690 |
| 10000+ | $26.2732 | $26,273.1750 |
| The price is for reference only, please refer to the actual quotation! | ||