XC4002XL-3PQ100I
XC4002XL-3PQ100I
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rohs

AMD Xilinx

XC4002XL-3PQ100I


XC4002XL-3PQ100I
F20-XC4002XL-3PQ100I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, QFP-100
PLASTIC, QFP-100

XC4002XL-3PQ100I ECAD Model


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XC4002XL-3PQ100I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 64
Number of Outputs 64
Number of Logic Cells 64
Number of Equivalent Gates 1000
Number of CLBs 64
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape RECTANGULAR
Technology CMOS
Organization 64 CLBS, 1000 GATES
Additional Feature MAX USABLE 1600 LOGIC GATES
Clock Frequency-Max 166 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description PLASTIC, QFP-100
Pin Count 100
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4002XL-3PQ100I Datasheet Download


XC4002XL-3PQ100I Overview



The XC4002XL-3PQ100I is a powerful chip model designed to be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. This chip model requires the use of HDL language for programming and implementation.


The original design intention of the XC4002XL-3PQ100I was to provide a high-performance, low-power solution for a variety of applications. It is capable of handling a wide range of tasks with great efficiency, making it an ideal choice for many applications. Additionally, the chip model is designed with future upgrades in mind, allowing for further expansion and improvement of its capabilities.


The product description of the XC4002XL-3PQ100I includes its ability to handle a wide range of tasks with great efficiency. It is capable of performing complex calculations quickly and accurately, making it suitable for use in advanced communication systems. Additionally, the chip model includes a variety of features that make it suitable for use in a variety of applications.


In terms of actual case studies, the XC4002XL-3PQ100I has been used in a variety of applications such as home automation, industrial automation, and automotive applications. In each case, the chip model was able to provide excellent performance with minimal power consumption. Additionally, the chip model was able to provide reliable and accurate results, making it a great choice for many applications.


When using the XC4002XL-3PQ100I, it is important to ensure that the chip model is properly programmed and configured for the application at hand. Additionally, it is important to ensure that the chip model is properly cooled, as overheating can lead to significant performance issues. Finally, it is important to ensure that the chip model is properly maintained and updated with the latest firmware and software updates.


Overall, the XC4002XL-3PQ100I is a powerful chip model designed to be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. This chip model requires the use of HDL language for programming and implementation, and is capable of providing excellent performance with minimal power consumption. Additionally, the chip model is designed with future upgrades in mind, allowing for further expansion and improvement of its capabilities. With proper programming and maintenance, the XC4002XL-3PQ100I can provide reliable and accurate results for a variety of applications.



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