AMD Xilinx
XC4002XL-3PQ100C
XC4002XL-3PQ100C ECAD Model
XC4002XL-3PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1600 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4002XL-3PQ100C Datasheet Download
XC4002XL-3PQ100C Overview
The XC4002XL-3PQ100C chip model is a product of Xilinx, a leading provider of advanced programmable logic solutions. It is a low-power, high-performance, and cost-effective FPGA chip model that is suitable for a wide range of applications.
The original design intention of the XC4002XL-3PQ100C was to provide a versatile and powerful solution for customers who are looking for a cost-effective FPGA chip model. It is designed to meet the needs of various applications, such as industrial automation, medical imaging, and communications. It is also designed to be compatible with the latest technologies, such as Artificial Intelligence (AI) and Machine Learning (ML).
The XC4002XL-3PQ100C chip model is capable of being upgraded in the future. It can be used in advanced communication systems, such as 5G networks and the Internet of Things (IoT). It can also be used in intelligent scenarios, such as autonomous driving, smart homes, and industrial automation. The chip model is designed to be highly reliable and efficient, making it suitable for a wide range of applications.
The product description of the XC4002XL-3PQ100C chip model includes several features, such as a wide range of I/O options, high-speed transceivers, and a rich set of memory resources. It also offers a wide range of power-saving features, such as dynamic voltage scaling and power-gating. Furthermore, the chip model is designed to be compatible with various development platforms, such as Vivado Design Suite and the Xilinx SDK.
Case studies have been conducted to evaluate the performance of the XC4002XL-3PQ100C chip model. The results of these studies have shown that the chip model is capable of meeting the design requirements of various applications. However, it is important to note that the chip model is not suitable for all applications. Therefore, it is important to carefully assess the requirements of the application before deciding to use the XC4002XL-3PQ100C chip model.
In conclusion, the XC4002XL-3PQ100C chip model is a powerful and cost-effective FPGA chip model that is suitable for a wide range of applications. It is designed to be compatible with the latest technologies, such as AI and ML, and it can be used in advanced communication systems and intelligent scenarios. The product description and case studies have shown that the chip model is capable of meeting the design requirements of various applications. However, it is important to carefully assess the requirements of the application before deciding to use the XC4002XL-3PQ100C chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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