
AMD Xilinx
XC4002XL-2PQ100I
XC4002XL-2PQ100I ECAD Model
XC4002XL-2PQ100I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 64 | |
Number of Outputs | 64 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 1.5 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 64 CLBS, 1000 GATES | |
Additional Feature | MAX USABLE 1600 LOGIC GATES | |
Clock Frequency-Max | 179 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.7X.9 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4002XL-2PQ100I Datasheet Download
XC4002XL-2PQ100I Overview
The chip model XC4002XL-2PQ100I is a high-performance, low-power integrated circuit that has been widely used in the global market. It is a multi-function chip that can be used in a variety of applications, including communication, computing, and storage. With its efficient design and high-performance features, it has been widely adopted by the industry.
The XC4002XL-2PQ100I is a versatile chip that can be used in a variety of applications. It is designed to provide high speed and low power consumption, making it ideal for use in networks and other applications that require high performance. It also supports multiple protocols, making it suitable for use in a variety of scenarios.
In terms of industry trends, the XC4002XL-2PQ100I is expected to continue to be widely adopted in the future. As the industry continues to evolve, the chip is expected to be used in more applications, such as in the era of fully intelligent systems. It is also expected to be used in more sophisticated scenarios, such as in the Internet of Things (IoT), virtual reality (VR), and augmented reality (AR).
The product description of the XC4002XL-2PQ100I states that it is a low-power, high-performance chip that supports multiple protocols and provides a high speed of operation. It is designed to be used in a variety of applications, including communication, computing, and storage. It is also designed to be used in a variety of environments, including in networks, IoT, VR, and AR.
When using the XC4002XL-2PQ100I, it is important to consider the specific design requirements of the application. This includes the power consumption, speed, and protocol support that the chip provides. It is also important to consider the operating environment, as the chip may need to be used in different scenarios.
In addition to considering the design requirements, it is also important to consider actual case studies and precautions when using the XC4002XL-2PQ100I. This includes understanding the limitations of the chip and the potential risks associated with its use. It is also important to consider the potential impact of any changes to the environment in which the chip is used, as this could affect its performance.
Overall, the XC4002XL-2PQ100I is a versatile chip that can be used in a variety of applications and environments. It is expected to continue to be widely adopted in the future, as the industry evolves and new technologies are developed. It is important to consider the design requirements, actual case studies, and precautions when using the chip, in order to ensure its safe and effective use.
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