AMD Xilinx
XC4002XL-1VQ100C
XC4002XL-1VQ100C ECAD Model
XC4002XL-1VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1600 LOGIC GATES | |
| Clock Frequency-Max | 200 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4002XL-1VQ100C Datasheet Download
XC4002XL-1VQ100C Overview
The chip model XC4002XL-1VQ100C is an innovative product developed by Xilinx Corporation, a leading provider of programmable logic solutions. This model is based on the company’s advanced FPGA technology and is designed to meet the needs of high-speed, low-power, and cost-effective applications. It is widely used in the fields of communication, automotive, industrial, medical, aerospace, and consumer electronics.
The chip model XC4002XL-1VQ100C is a highly integrated device that can provide a variety of functions, such as high-speed data processing, low-power operation, and low-cost solutions. It is also highly flexible, allowing for fast and easy customization of the device to meet specific customer requirements. This makes it an ideal choice for a wide range of applications.
As the chip model XC4002XL-1VQ100C continues to evolve, it is likely that the industry trends of this model will also continue to change. The development of new technologies and applications may require the chip model to be upgraded in order to support them. For example, the chip model may need to be upgraded to support the development and popularization of future intelligent robots.
In terms of the chip model’s original design intention, it was designed to provide high-speed, low-power, and cost-effective solutions for a wide range of applications. It is also capable of being upgraded to support new technologies and applications. In addition, the chip model can be used in advanced communication systems, making it an ideal choice for companies looking to develop and deploy such systems.
In order to effectively use the chip model XC4002XL-1VQ100C, there are certain technical skills and knowledge that must be acquired. This includes a good understanding of FPGA technology, as well as the ability to design and implement complex logic functions. Additionally, knowledge of the chip model’s application environment and the ability to troubleshoot any problems that may arise is also essential.
In conclusion, the chip model XC4002XL-1VQ100C is a highly versatile and cost-effective solution for a wide range of applications. It is capable of being upgraded to support new technologies and applications, and can be used in advanced communication systems. In order to effectively use the chip model, certain technical skills and knowledge must be acquired. As the chip model continues to evolve, the industry trends of the model will also continue to change, allowing for the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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