AMD Xilinx
XC4002XL-1PQ100C
XC4002XL-1PQ100C ECAD Model
XC4002XL-1PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 1.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1600 LOGIC GATES | |
| Clock Frequency-Max | 200 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4002XL-1PQ100C Datasheet Download
XC4002XL-1PQ100C Overview
The XC4002XL-1PQ100C chip model is a high-performance, low-power integrated circuit designed to meet the needs of modern communication systems. It is an advanced, multi-functional, single-chip solution that can be used for a variety of applications, including wireless communication, signal processing, and power management. It is also capable of providing robust performance in harsh environments.
The XC4002XL-1PQ100C chip model offers a number of advantages over other chip models. It is designed to provide high-speed data transmission and low-power consumption, making it ideal for use in battery-powered applications. It also features an integrated memory controller and an advanced power management unit, allowing for efficient utilization of power resources. Furthermore, it has an integrated programmable logic array, allowing for easy customization and integration into existing systems.
The XC4002XL-1PQ100C chip model is expected to experience significant demand in the future, as the need for advanced communication systems continues to grow. It is especially well-suited for use in the automotive, aerospace, and medical industries, as it can provide reliable performance in the most demanding of conditions. It can also be used in the Internet of Things (IoT) and 5G networks, where it can provide high-speed data transmission and low-power consumption.
The XC4002XL-1PQ100C chip model has a number of design features that make it well-suited for use in communication systems. It has an integrated memory controller, allowing for efficient utilization of memory resources. It also has an integrated programmable logic array, allowing for easy customization and integration into existing systems. Furthermore, it has an advanced power management unit, allowing for efficient utilization of power resources.
The XC4002XL-1PQ100C chip model is designed to be highly reliable and robust, meaning it can be used in a wide range of applications. It has been tested in a variety of conditions, including extreme temperatures, high-voltage environments, and in the presence of electromagnetic interference. Furthermore, it has been designed to provide high-speed data transmission and low-power consumption, making it ideal for use in battery-powered applications.
The XC4002XL-1PQ100C chip model is also designed to be upgradable, meaning it can be used in future communication systems. It is capable of providing robust performance in harsh environments, and it can be used in the Internet of Things (IoT) and 5G networks, where it can provide high-speed data transmission and low-power consumption. Furthermore, it can be used in advanced communication systems, as it is capable of providing reliable performance in the most demanding of conditions.
When installing the XC4002XL-1PQ100C chip model, it is important to ensure that all of the necessary components are present and that the installation is done correctly. It is also important to ensure that the chip is properly cooled and that it is not exposed to excessive temperatures. Furthermore, it is important to ensure that the chip is not exposed to any form of electromagnetic interference, as this can affect its performance.
In conclusion, the XC4002XL-1PQ100C chip model is an advanced, multi-functional, single-chip solution that can be used for a variety of applications. It is designed to provide high-speed data transmission and low-power consumption, making it ideal for use in battery-powered applications. It also features an integrated memory controller and an advanced power management unit, allowing for efficient utilization of power resources. Furthermore, it has an integrated programmable logic array, allowing for easy customization and integration into existing systems. It is expected to experience significant demand in the future, as the need for advanced communication systems continues to grow.
You May Also Be Interested In
2,960 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||