XC3SD3400A-4FGG676I

The XC3SD3400A-4FGG676I is an FPGA (Field-Programmable Gate Array) chip designed and manufactured by Xilinx, Inc. It is a low-cost, low-power, low-density device with a maximum operating frequency of up to 300 MHz. The device features a 676-pin BGA (Ball Grid Array) package and has a maximum power dissipation of 2.5 W.

The XC3SD3400A-4FGG676I has 6,400 logic cells, 368 Kbits of block RAM, and 8 DSP slices. It also includes a low-power clock management unit, an integrated JTAG port, and a variety of high-speed serial transceivers. The device is also equipped with a variety of I/O options including LVTTL, LVCMOS, and GTL.

The XC3SD3400A-4FGG676I is suitable for a wide range of applications such as industrial control, automotive, medical, and communications systems. It is ideal for designs requiring low power and low cost, as well as for high-performance applications that require high-speed signal processing.

The XC3SD3400A-4FGG676I is a versatile FPGA device that can be used to implement a wide range of digital designs. It is a cost-effective solution for applications that require low power and low cost, as well as high-speed signal processing. The device is designed to meet the needs of a wide range of applications and is suitable for a variety of applications in industrial control, automotive, medical, and communications systems.