XC3SD1800A-4FG676C
XC3SD1800A-4FG676C
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rohs

AMD Xilinx

XC3SD1800A-4FG676C


XC3SD1800A-4FG676C
F20-XC3SD1800A-4FG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-676
FBGA-676

XC3SD1800A-4FG676C ECAD Model


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XC3SD1800A-4FG676C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 519
Number of Outputs 409
Number of Logic Cells 37440
Number of Equivalent Gates 1800000
Number of CLBs 4160
Combinatorial Delay of a CLB-Max 710 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 4160 CLBS, 1800000 GATES
Clock Frequency-Max 250 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-676
Pin Count 676
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC3SD1800A-4FG676C Datasheet Download


XC3SD1800A-4FG676C Overview



The chip model XC3SD1800A-4FG676C is one of the latest models of Xilinx's Spartan-3A family of field-programmable gate arrays (FPGAs). It is a powerful and reliable chip model that offers users a wide range of features and capabilities. It is designed to meet the needs of a variety of applications, including those in the industrial, automotive, and consumer markets.


The XC3SD1800A-4FG676C is a highly versatile chip model that can be used for a wide range of applications. It has a wide range of features, including high-speed transceivers, low-power operation, and configurable logic blocks. It also has a wide range of I/O options, including USB, Ethernet, and Wi-Fi. This makes it a great choice for applications that require high-speed communication and data transfer.


In terms of industry trends, the XC3SD1800A-4FG676C is expected to be in high demand in the near future. This is due to the increasing demand for high-performance and reliable FPGAs in various industries. With the rise of the Internet of Things (IoT), the demand for FPGAs is expected to increase even further. Furthermore, the XC3SD1800A-4FG676C is well-suited for use in networks, as it is equipped with various communication protocols.


The XC3SD1800A-4FG676C is also expected to be used in intelligent scenarios in the near future. This is due to its ability to support intelligent systems, such as artificial intelligence (AI) and machine learning (ML). The chip model is also capable of supporting various intelligent applications, such as natural language processing (NLP) and image recognition. This makes it an ideal choice for applications that require intelligent features.


Overall, the XC3SD1800A-4FG676C is a powerful and reliable chip model that is expected to be in high demand in the near future. It is well-suited for use in networks and can be used in intelligent scenarios. It is also capable of supporting various intelligent applications, making it an ideal choice for applications that require intelligent features. Therefore, the XC3SD1800A-4FG676C is expected to be a popular choice for many industries in the near future.



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Unit Price: $86.856
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Pricing (USD)

QTY Unit Price Ext Price
1+ $80.7761 $80.7761
10+ $79.9075 $799.0752
100+ $75.5647 $7,556.4720
1000+ $71.2219 $35,610.9600
10000+ $65.1420 $65,142.0000
The price is for reference only, please refer to the actual quotation!

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