
AMD Xilinx
XC3SD1800A-4FG676C
XC3SD1800A-4FG676C ECAD Model
XC3SD1800A-4FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 519 | |
Number of Outputs | 409 | |
Number of Logic Cells | 37440 | |
Number of Equivalent Gates | 1800000 | |
Number of CLBs | 4160 | |
Combinatorial Delay of a CLB-Max | 710 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4160 CLBS, 1800000 GATES | |
Clock Frequency-Max | 250 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC3SD1800A-4FG676C Datasheet Download
XC3SD1800A-4FG676C Overview
The chip model XC3SD1800A-4FG676C is one of the latest models of Xilinx's Spartan-3A family of field-programmable gate arrays (FPGAs). It is a powerful and reliable chip model that offers users a wide range of features and capabilities. It is designed to meet the needs of a variety of applications, including those in the industrial, automotive, and consumer markets.
The XC3SD1800A-4FG676C is a highly versatile chip model that can be used for a wide range of applications. It has a wide range of features, including high-speed transceivers, low-power operation, and configurable logic blocks. It also has a wide range of I/O options, including USB, Ethernet, and Wi-Fi. This makes it a great choice for applications that require high-speed communication and data transfer.
In terms of industry trends, the XC3SD1800A-4FG676C is expected to be in high demand in the near future. This is due to the increasing demand for high-performance and reliable FPGAs in various industries. With the rise of the Internet of Things (IoT), the demand for FPGAs is expected to increase even further. Furthermore, the XC3SD1800A-4FG676C is well-suited for use in networks, as it is equipped with various communication protocols.
The XC3SD1800A-4FG676C is also expected to be used in intelligent scenarios in the near future. This is due to its ability to support intelligent systems, such as artificial intelligence (AI) and machine learning (ML). The chip model is also capable of supporting various intelligent applications, such as natural language processing (NLP) and image recognition. This makes it an ideal choice for applications that require intelligent features.
Overall, the XC3SD1800A-4FG676C is a powerful and reliable chip model that is expected to be in high demand in the near future. It is well-suited for use in networks and can be used in intelligent scenarios. It is also capable of supporting various intelligent applications, making it an ideal choice for applications that require intelligent features. Therefore, the XC3SD1800A-4FG676C is expected to be a popular choice for many industries in the near future.
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5,739 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $80.7761 | $80.7761 |
10+ | $79.9075 | $799.0752 |
100+ | $75.5647 | $7,556.4720 |
1000+ | $71.2219 | $35,610.9600 |
10000+ | $65.1420 | $65,142.0000 |
The price is for reference only, please refer to the actual quotation! |