AMD Xilinx
XC3S700AN-5FG484C
XC3S700AN-5FG484C ECAD Model
XC3S700AN-5FG484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 372 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 13248 | |
| Number of Equivalent Gates | 700000 | |
| Number of CLBs | 1472 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1472 CLBS, 700000 GATES | |
| Clock Frequency-Max | 770 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 484 |
XC3S700AN-5FG484C Datasheet Download
XC3S700AN-5FG484C Overview
The XC3S700AN-5FG484C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, making it an ideal choice for high-performance applications. With its advanced features, the chip model can be used to develop and popularize future intelligent robots, and its original design intention allows for future upgrades.
The XC3S700AN-5FG484C chip model is a powerful tool for digital signal processing and image processing. It is designed to be used with HDL language, making it an ideal choice for high-performance applications. It is equipped with features such as high-speed signal processing, low-power operation, and high-density logic. This makes it an ideal choice for embedded processing applications, as well as for advanced communication systems.
The XC3S700AN-5FG484C chip model can also be used for the development and popularization of future intelligent robots. It is designed to be used with HDL language, making it an ideal choice for high-performance applications. By utilizing the chip model’s advanced features, developers can create robots with powerful capabilities. The chip model can also be upgraded with the latest features, allowing for the development of more advanced robots.
To use the XC3S700AN-5FG484C chip model effectively, developers need to have a good understanding of HDL language. They should also have a good grasp of digital signal processing and embedded systems. Additionally, they should have knowledge of image processing and robotics. With these skills, developers can effectively use the chip model for the development and popularization of future intelligent robots.
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1,949 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $102.5425 | $102.5425 |
| 10+ | $101.4399 | $1,014.3994 |
| 100+ | $95.9269 | $9,592.6896 |
| 1000+ | $90.4139 | $45,206.9280 |
| 10000+ | $82.6956 | $82,695.6000 |
| The price is for reference only, please refer to the actual quotation! | ||