XC3S700A-6FG484C
XC3S700A-6FG484C
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AMD Xilinx

XC3S700A-6FG484C


XC3S700A-6FG484C
F20-XC3S700A-6FG484C
Active
BGA

XC3S700A-6FG484C ECAD Model


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XC3S700A-6FG484C Attributes


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XC3S700A-6FG484C Overview



The XC3S700A-6FG484C chip model is a powerful and versatile model that is designed to meet the needs of a wide range of applications. It is a Field Programmable Gate Array (FPGA) that provides users with a wide range of features and capabilities. It is specifically designed to provide users with the ability to customize their designs and to enable them to quickly and easily develop their own applications.


The XC3S700A-6FG484C chip model is equipped with a range of features and capabilities, including high-speed digital signal processing, high-speed memory access, and high-speed I/O. It also features a wide range of programmable logic, including programmable logic blocks, configurable logic blocks, and configurable memory blocks. This makes it ideal for a range of applications, such as embedded systems, communications, and industrial automation.


The chip model is also designed to be highly reliable and to provide users with a high level of performance. It is designed to be able to handle high-speed data transfers, and it is also designed to be able to handle a wide range of applications. This makes it an ideal choice for applications that require high-speed data transfers, such as wireless communication systems.


In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols. This makes it an ideal choice for applications that require support for advanced communication systems. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation.


The XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. It is also designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


The XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


The XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


The XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


The XC3S700A-6FG484C chip model is designed to meet the specific needs of a wide range of applications. It is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


The XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


In terms of industry trends, the XC3S700A-6FG484C chip model is designed to meet the specific needs of a wide range of applications. It is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a wide range of applications, including embedded systems, communications, and industrial automation. In addition, the chip model is designed to be able to support a wide range of technologies, including Ethernet, USB, and other communication protocols.


When it comes to the future development of related industries, the XC3S700A-6FG484C chip model is designed to be highly reliable and to provide users with a high level of performance. It is also designed to be able to handle a



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