AMD Xilinx
XC3S700A-5FT256C
XC3S700A-5FT256C ECAD Model
XC3S700A-5FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 161 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 13248 | |
| Number of Equivalent Gates | 700000 | |
| Number of CLBs | 1472 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1472 CLBS, 700000 GATES | |
| Clock Frequency-Max | 770 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FTBGA-256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 | |
| ECCN Code | EAR99 |
XC3S700A-5FT256C Datasheet Download
XC3S700A-5FT256C Overview
The XC3S700A-5FT256C chip model is a powerful and versatile model that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) to create powerful and efficient systems. With its programmable logic, the XC3S700A-5FT256C has the potential to be used in a variety of advanced communication systems.
The XC3S700A-5FT256C chip model is designed to be easily upgradeable, allowing users to make improvements to the system without needing to replace the chip. This makes the model ideal for use in networks, as it can be adapted to fit changing requirements. Additionally, the chip model is suitable for use in intelligent scenarios, such as machine learning and artificial intelligence. Its powerful processing capabilities make it ideal for these applications.
The XC3S700A-5FT256C chip model is also well suited for use in the era of fully intelligent systems. Its powerful processing capabilities and programmable logic make it ideal for creating intelligent systems that can interact with their environment. Additionally, its upgradeable design allows for easy expansion and adaptation to changing requirements. This makes the XC3S700A-5FT256C an ideal choice for use in intelligent systems.
In conclusion, the XC3S700A-5FT256C chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed to be used with HDL to create powerful and efficient systems, and it is upgradeable for use in networks and intelligent scenarios. Additionally, its powerful processing capabilities make it ideal for use in the era of fully intelligent systems.
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5,326 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $62.1871 | $62.1871 |
| 10+ | $61.5184 | $615.1838 |
| 100+ | $58.1750 | $5,817.4986 |
| 1000+ | $54.8316 | $27,415.7980 |
| 10000+ | $50.1509 | $50,150.8500 |
| The price is for reference only, please refer to the actual quotation! | ||