XC3S700A-5FGG400C

The XC3S700A-5FGG400C is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is an advanced FPGA device with a Spartan-3A architecture. It is a 7-series device, which means it has the latest features, such as the ability to support up to two million logic cells, up to 4,096 Digital Signal Processing (DSP) slices, and up to 1.2 million flip-flops.

The XC3S700A-5FGG400C has a total of 400K logic cells, 4,096 DSP slices, and 1.2 million flip-flops. It has a maximum clock frequency of 500 MHz and a maximum I/O count of 696. It also has up to 16 user-defined I/O banks, with up to 24 I/O pins per bank. It has an operating temperature range of -40°C to +85°C, and it is available in both a commercial and industrial temperature range.

The XC3S700A-5FGG400C can be used in a variety of applications, such as embedded systems, communication, industrial automation, medical imaging, and aerospace. It is also suitable for applications such as video and image processing, motor control, and high-performance computing. It is also ideal for applications requiring high-speed data transfer and low latency.

The XC3S700A-5FGG400C is a powerful and reliable FPGA chip that is ideal for a wide range of applications. It has a high level of integration, allowing for a wide range of features and capabilities. It is also highly reliable and has a wide operating temperature range. It is suitable for a variety of applications, including embedded systems, communication, industrial automation, medical imaging, and aerospace.