
AMD Xilinx
XC3S700A-5FG484C
XC3S700A-5FG484C ECAD Model
XC3S700A-5FG484C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 372 | |
Number of Outputs | 288 | |
Number of Logic Cells | 13248 | |
Number of Equivalent Gates | 700000 | |
Number of CLBs | 1472 | |
Combinatorial Delay of a CLB-Max | 620 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1472 CLBS, 700000 GATES | |
Clock Frequency-Max | 770 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-484 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 484 | |
ECCN Code | 3A991.D |
XC3S700A-5FG484C Datasheet Download
XC3S700A-5FG484C Overview
The Xilinx XC3S700A-5FG484C is a powerful and versatile FPGA chip model that has revolutionized the chip industry. As the industry continues to advance, the XC3S700A-5FG484C has become a popular choice for many applications due to its unique features and capabilities.
The XC3S700A-5FG484C is a high-performance FPGA chip model with a wide range of features and capabilities. It has a large capacity of up to 700K logic cells, which can be used to implement complex functions. It also has a high-speed transceiver, which can be used to transfer data at up to 10 Gbps. The chip is also highly configurable, allowing users to customize their designs to meet their specific requirements.
The XC3S700A-5FG484C is a versatile chip model that is suitable for a wide range of applications. It can be used for a variety of applications, such as industrial automation, medical imaging, automotive systems, and more. The chip can also be used in the development of high-performance embedded systems.
In terms of the industry trends of the XC3S700A-5FG484C, there is expected to be an increasing demand for the chip model in the future. This is due to its versatility and the fact that it is suitable for a wide range of applications. Additionally, the chip is highly configurable, allowing users to customize their designs to meet their specific requirements.
In terms of the product description and specific design requirements of the XC3S700A-5FG484C, the chip model is a high-performance FPGA chip model with a wide range of features and capabilities. It has a large capacity of up to 700K logic cells, which can be used to implement complex functions. It also has a high-speed transceiver, which can be used to transfer data at up to 10 Gbps. Additionally, the chip is highly configurable, allowing users to customize their designs to meet their specific requirements.
When it comes to actual case studies, the XC3S700A-5FG484C has been used in a variety of applications, such as industrial automation, medical imaging, automotive systems, and more. In terms of industrial automation, the chip model has been used to control and monitor the operation of industrial machinery. In medical imaging, the chip model has been used to develop high-performance imaging systems. In automotive systems, the chip model has been used to develop advanced driver assistance systems.
Finally, when it comes to precautions, it is important to remember that the XC3S700A-5FG484C is a powerful and versatile chip model and should be used with caution. It is important to understand the specific design requirements of the chip model and to ensure that it is properly configured for the application. Additionally, it is important to ensure that the chip is compatible with the application environment and that it has the necessary support for the technologies needed.
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5,996 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $54.7361 | $54.7361 |
10+ | $54.1475 | $541.4752 |
100+ | $51.2047 | $5,120.4720 |
1000+ | $48.2619 | $24,130.9600 |
10000+ | $44.1420 | $44,142.0000 |
The price is for reference only, please refer to the actual quotation! |