XC3S700A-5FG484C
XC3S700A-5FG484C
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rohs

AMD Xilinx

XC3S700A-5FG484C


XC3S700A-5FG484C
F20-XC3S700A-5FG484C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-484
FBGA-484

XC3S700A-5FG484C ECAD Model


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XC3S700A-5FG484C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 372
Number of Outputs 288
Number of Logic Cells 13248
Number of Equivalent Gates 700000
Number of CLBs 1472
Combinatorial Delay of a CLB-Max 620 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1472 CLBS, 700000 GATES
Clock Frequency-Max 770 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-484
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 484
ECCN Code 3A991.D

XC3S700A-5FG484C Datasheet Download


XC3S700A-5FG484C Overview



The Xilinx XC3S700A-5FG484C is a powerful and versatile FPGA chip model that has revolutionized the chip industry. As the industry continues to advance, the XC3S700A-5FG484C has become a popular choice for many applications due to its unique features and capabilities.


The XC3S700A-5FG484C is a high-performance FPGA chip model with a wide range of features and capabilities. It has a large capacity of up to 700K logic cells, which can be used to implement complex functions. It also has a high-speed transceiver, which can be used to transfer data at up to 10 Gbps. The chip is also highly configurable, allowing users to customize their designs to meet their specific requirements.


The XC3S700A-5FG484C is a versatile chip model that is suitable for a wide range of applications. It can be used for a variety of applications, such as industrial automation, medical imaging, automotive systems, and more. The chip can also be used in the development of high-performance embedded systems.


In terms of the industry trends of the XC3S700A-5FG484C, there is expected to be an increasing demand for the chip model in the future. This is due to its versatility and the fact that it is suitable for a wide range of applications. Additionally, the chip is highly configurable, allowing users to customize their designs to meet their specific requirements.


In terms of the product description and specific design requirements of the XC3S700A-5FG484C, the chip model is a high-performance FPGA chip model with a wide range of features and capabilities. It has a large capacity of up to 700K logic cells, which can be used to implement complex functions. It also has a high-speed transceiver, which can be used to transfer data at up to 10 Gbps. Additionally, the chip is highly configurable, allowing users to customize their designs to meet their specific requirements.


When it comes to actual case studies, the XC3S700A-5FG484C has been used in a variety of applications, such as industrial automation, medical imaging, automotive systems, and more. In terms of industrial automation, the chip model has been used to control and monitor the operation of industrial machinery. In medical imaging, the chip model has been used to develop high-performance imaging systems. In automotive systems, the chip model has been used to develop advanced driver assistance systems.


Finally, when it comes to precautions, it is important to remember that the XC3S700A-5FG484C is a powerful and versatile chip model and should be used with caution. It is important to understand the specific design requirements of the chip model and to ensure that it is properly configured for the application. Additionally, it is important to ensure that the chip is compatible with the application environment and that it has the necessary support for the technologies needed.



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Unit Price: $58.856
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $54.7361 $54.7361
10+ $54.1475 $541.4752
100+ $51.2047 $5,120.4720
1000+ $48.2619 $24,130.9600
10000+ $44.1420 $44,142.0000
The price is for reference only, please refer to the actual quotation!

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