XC3S700A-5FG400C
XC3S700A-5FG400C
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rohs

AMD Xilinx

XC3S700A-5FG400C


XC3S700A-5FG400C
F20-XC3S700A-5FG400C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-400
FBGA-400

XC3S700A-5FG400C ECAD Model


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XC3S700A-5FG400C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 311
Number of Outputs 248
Number of Logic Cells 13248
Number of Equivalent Gates 700000
Number of CLBs 1472
Combinatorial Delay of a CLB-Max 620 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1472 CLBS, 700000 GATES
Clock Frequency-Max 770 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B400
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 400
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA400,20X20,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 21 mm
Length 21 mm
Seated Height-Max 2.43 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-400
Pin Count 400
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC3S700A-5FG400C Datasheet Download


XC3S700A-5FG400C Overview



The chip model XC3S700A-5FG400C is a modern semiconductor device that has been developed to meet the growing needs of the electronics industry. This chip is manufactured by Xilinx, Inc., and is based on their Virtex-5 FPGA technology. It is designed to provide a high level of performance and reliability while also being cost-effective.


The XC3S700A-5FG400C is a highly versatile chip that can be used in a wide range of applications. It features a high-speed, high-performance architecture that is suitable for a wide variety of communication systems. It has a wide range of features, including support for multiple clock frequencies, multiple I/O interfaces, and a variety of memory options. This chip is also designed to be highly reliable and robust, and is capable of operating in extreme temperatures and harsh environments.


The chip model XC3S700A-5FG400C is designed to meet the needs of the most demanding applications. It is capable of providing high-speed data transfer rates, as well as support for advanced communication protocols and technologies. Its high-performance architecture is suitable for applications such as high-speed networking, video streaming, and high-speed data processing.


The chip model XC3S700A-5FG400C is expected to be in high demand in the future, as it is capable of providing a high level of performance and reliability while also being cost-effective. Its wide range of features make it suitable for a variety of applications, and its high-performance architecture is suitable for advanced communication systems. The chip is also designed to be upgradeable, allowing for future upgrades and enhancements.


The chip model XC3S700A-5FG400C is a highly advanced semiconductor device that is designed to meet the needs of the most demanding applications. Its high-performance architecture and wide range of features make it suitable for a variety of applications, and its upgradeability allows for future upgrades and enhancements. The chip model is expected to be in high demand in the future, as it is capable of providing a high level of performance and reliability while also being cost-effective.



1,985 In Stock


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Unit Price: $52.976
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Pricing (USD)

QTY Unit Price Ext Price
1+ $49.2677 $49.2677
10+ $48.7379 $487.3792
100+ $46.0891 $4,608.9120
1000+ $43.4403 $21,720.1600
10000+ $39.7320 $39,732.0000
The price is for reference only, please refer to the actual quotation!

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