
AMD Xilinx
XC3S700A-5FG400C
XC3S700A-5FG400C ECAD Model
XC3S700A-5FG400C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 311 | |
Number of Outputs | 248 | |
Number of Logic Cells | 13248 | |
Number of Equivalent Gates | 700000 | |
Number of CLBs | 1472 | |
Combinatorial Delay of a CLB-Max | 620 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1472 CLBS, 700000 GATES | |
Clock Frequency-Max | 770 MHz | |
Power Supplies | 1.2,2.5/3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B400 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 400 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA400,20X20,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
Length | 21 mm | |
Seated Height-Max | 2.43 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-400 | |
Pin Count | 400 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC3S700A-5FG400C Datasheet Download
XC3S700A-5FG400C Overview
The chip model XC3S700A-5FG400C is a modern semiconductor device that has been developed to meet the growing needs of the electronics industry. This chip is manufactured by Xilinx, Inc., and is based on their Virtex-5 FPGA technology. It is designed to provide a high level of performance and reliability while also being cost-effective.
The XC3S700A-5FG400C is a highly versatile chip that can be used in a wide range of applications. It features a high-speed, high-performance architecture that is suitable for a wide variety of communication systems. It has a wide range of features, including support for multiple clock frequencies, multiple I/O interfaces, and a variety of memory options. This chip is also designed to be highly reliable and robust, and is capable of operating in extreme temperatures and harsh environments.
The chip model XC3S700A-5FG400C is designed to meet the needs of the most demanding applications. It is capable of providing high-speed data transfer rates, as well as support for advanced communication protocols and technologies. Its high-performance architecture is suitable for applications such as high-speed networking, video streaming, and high-speed data processing.
The chip model XC3S700A-5FG400C is expected to be in high demand in the future, as it is capable of providing a high level of performance and reliability while also being cost-effective. Its wide range of features make it suitable for a variety of applications, and its high-performance architecture is suitable for advanced communication systems. The chip is also designed to be upgradeable, allowing for future upgrades and enhancements.
The chip model XC3S700A-5FG400C is a highly advanced semiconductor device that is designed to meet the needs of the most demanding applications. Its high-performance architecture and wide range of features make it suitable for a variety of applications, and its upgradeability allows for future upgrades and enhancements. The chip model is expected to be in high demand in the future, as it is capable of providing a high level of performance and reliability while also being cost-effective.
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1,985 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $49.2677 | $49.2677 |
10+ | $48.7379 | $487.3792 |
100+ | $46.0891 | $4,608.9120 |
1000+ | $43.4403 | $21,720.1600 |
10000+ | $39.7320 | $39,732.0000 |
The price is for reference only, please refer to the actual quotation! |