AMD Xilinx
XC3S50AN-5FT256C
XC3S50AN-5FT256C ECAD Model
XC3S50AN-5FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Spartan®-3AN | |
| Package | Tray | |
| Number of LABs/CLBs | 176 | |
| Number of Logic Elements/Cells | 1584 | |
| Total RAM Bits | 55296 | |
| Number of I/O | 195 | |
| Number of Gates | 50000 | |
| Voltage - Supply | 1.14V ~ 1.26V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FTBGA (17x17) | |
| Base Product Number | XC3S50AN |
XC3S50AN-5FT256C Datasheet Download
XC3S50AN-5FT256C Overview
The XC3S50AN-5FT256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Spartan-3AN architecture and is designed to be used in a variety of applications. It has a total of 50,000 logic cells, 256Kbits of embedded memory, and 8 DSP slices. It also features two integrated transceivers and two clock management tiles.
The XC3S50AN-5FT256C is designed to provide a cost-effective solution for a variety of applications. It offers a high level of flexibility, allowing users to customize the chip to their specific needs. It is also designed to be power efficient, consuming only 1.1W of power when operating at a maximum frequency of 250MHz.
The chip is suitable for a range of applications, including embedded systems, automotive, industrial, medical, and consumer electronics. It is also used for aerospace and defense applications, as well as for networking and communications.
The XC3S50AN-5FT256C is a reliable and cost-effective solution for many applications. It is designed to be easy to use and configure, and offers a high level of flexibility. It is also power efficient, making it an ideal choice for a variety of applications.
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5,270 In Stock
Pricing (USD)
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