XC3S50AN-4FTG256I
XC3S50AN-4FTG256I
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AMD Xilinx

XC3S50AN-4FTG256I


XC3S50AN-4FTG256I
F20-XC3S50AN-4FTG256I
Active
IC FPGA 195 I/O 256FTBGA
256-FTBGA (17x17)

XC3S50AN-4FTG256I ECAD Model


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XC3S50AN-4FTG256I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3AN
Package Tray
Number of LABs/CLBs 176
Number of Logic Elements/Cells 1584
Total RAM Bits 55296
Number of I/O 195
Number of Gates 50000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number XC3S50AN

XC3S50AN-4FTG256I Datasheet Download


XC3S50AN-4FTG256I Overview



The XC3S50AN-4FTG256I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is an ideal solution for implementing high-performance, cost-effective system designs. The chip has a capacity of 50K logic cells and 256KB of fast on-chip memory. It is designed to be used in a wide range of applications including communications, networking, digital signal processing, industrial automation, medical imaging and automotive.


The XC3S50AN-4FTG256I has a speed grade of -4, which means it can operate at up to 250MHz. It has a total of 144 I/O pins, of which 64 are dedicated to general-purpose I/O and the remaining 80 are used for high-speed transceivers. It also has 4 clock input pins and 4 clock output pins. The chip is powered by a single +3.3V power supply and features an integrated power management unit.


The chip is also equipped with various features such as advanced I/O support, high-speed memory support, high-speed transceiver support, and a wide range of user-programmable logic. It also has an integrated JTAG debugger and a range of on-chip debugging features. The chip is designed to be used in a wide range of applications, from high-performance embedded systems to low-power applications. It supports a wide range of development tools and can be easily integrated into existing designs.



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