XC3S50AN-4FT256I
XC3S50AN-4FT256I
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rohs

AMD Xilinx

XC3S50AN-4FT256I


XC3S50AN-4FT256I
F20-XC3S50AN-4FT256I
Active
IC FPGA 195 I/O 256FTBGA
256-FTBGA (17x17)

XC3S50AN-4FT256I ECAD Model


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XC3S50AN-4FT256I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3AN
Package Tray
Number of LABs/CLBs 176
Number of Logic Elements/Cells 1584
Total RAM Bits 55296
Number of I/O 195
Number of Gates 50000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number XC3S50AN

XC3S50AN-4FT256I Datasheet Download


XC3S50AN-4FT256I Overview



The XC3S50AN-4FT256I is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It is a low-cost, low-power, high-performance FPGA that can be used for a variety of applications.


The chip has a Virtex-3 SX50 core and is packaged in a 256-pin PQFP (Plastic Quad Flat Pack) package. It has a total of 50,000 logic cells, 4,608 Kbits of RAM, and 256 I/O pins. The I/O pins are divided into four banks of 64 pins each. It also has four clock management tiles and two PowerPC405 processors.


The chip is capable of running at speeds up to 200 MHz and has a maximum power consumption of 2.4W. It has a temperature range of -40°C to +85°C and is RoHS compliant.


The chip can be used in a variety of applications, including embedded systems, video and image processing, industrial automation, and communications. It can also be used for prototyping, and for designing and implementing systems with high performance and low power consumption.


Overall, the XC3S50AN-4FT256I is a high-performance, low-cost, low-power FPGA that can be used in a variety of applications. It is an ideal choice for those looking for an FPGA that can provide excellent performance and power efficiency.



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