AMD Xilinx
XC3S50A-5FT256C
XC3S50A-5FT256C ECAD Model
XC3S50A-5FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 112 | |
| Number of Logic Cells | 1584 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 176 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 176 CLBS, 50000 GATES | |
| Clock Frequency-Max | 770 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC3S50A-5FT256C Datasheet Download
XC3S50A-5FT256C Overview
The chip model XC3S50A-5FT256C is a powerful and reliable model designed for advanced communication systems. It is a Field-Programmable Gate Array (FPGA) device with a built-in logic array and a powerful set of features. It is capable of supporting a wide range of applications, from low-level signal processing to high-level data processing.
The chip model XC3S50A-5FT256C is designed to be highly versatile and can be used in a variety of applications. It is capable of supporting advanced communication systems, such as wireless communication, satellite communication, and 4G/5G networks. In addition, it can also be used in industrial automation, medical systems, and automotive systems.
As the chip model XC3S50A-5FT256C is designed to support advanced communication systems, it is also suitable for the development and popularization of future intelligent robots. This is because the model is capable of handling complex data processing tasks and can be programmed to respond to various environmental inputs. As such, it can be used to create autonomous robots that can navigate their environment and interact with other devices.
In terms of industry trends, the chip model XC3S50A-5FT256C is expected to continue to be popular in the future. This is because it is highly versatile and can be used in a variety of applications. In addition, it can be upgraded with new technologies if the application environment requires it.
In order to use the chip model XC3S50A-5FT256C effectively, technical talents with knowledge of FPGA programming, signal processing, and data processing are needed. These professionals should also have knowledge of communication systems, industrial automation, and robotics. With the right skills, the chip model XC3S50A-5FT256C can be used to create powerful and reliable applications that can help to advance the development of intelligent robots and other advanced communication systems.
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5,555 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24.2711 | $24.2711 |
| 10+ | $24.0102 | $240.1016 |
| 100+ | $22.7053 | $2,270.5260 |
| 1000+ | $21.4004 | $10,700.1800 |
| 10000+ | $19.5735 | $19,573.5000 |
| The price is for reference only, please refer to the actual quotation! | ||