XC3S500E-4VQ100I
XC3S500E-4VQ100I
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AMD Xilinx

XC3S500E-4VQ100I


XC3S500E-4VQ100I
F20-XC3S500E-4VQ100I
Active
QFP100

XC3S500E-4VQ100I ECAD Model


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XC3S500E-4VQ100I Attributes


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XC3S500E-4VQ100I Overview



The chip model XC3S500E-4VQ100I is a modern integrated circuit designed by Xilinx and manufactured by TSMC. This chip is intended to be used in a variety of applications such as digital signal processing, video processing, and communication systems. It is a field-programmable gate array (FPGA) that is designed to be highly configurable and easily upgraded.


The XC3S500E-4VQ100I is a powerful chip with a wide range of features and capabilities. It is capable of running at speeds up to 500 MHz and has a total of 4,096 logic cells. This chip also utilizes a variety of different technologies, such as embedded memory blocks, distributed RAM, and multipliers. Additionally, it is equipped with several powerful I/O interfaces, such as a high-speed serial port and a high-speed differential I/O.


The XC3S500E-4VQ100I is an ideal choice for applications that require high-performance, reliable, and flexible solutions. It is capable of supporting a variety of different technologies, such as Ethernet, USB, and PCI Express. Additionally, this chip is designed to be easily upgradeable, allowing for future expansion and customization.


When considering the application environment of the XC3S500E-4VQ100I, it is important to consider the specific technologies that are needed. Depending on the application, certain technologies may be more suitable than others. For example, if the application requires high-speed communication, then the chip should be equipped with a high-speed serial port or a high-speed differential I/O. Additionally, if the application requires high-performance computing, then the chip should be equipped with powerful embedded memory blocks and multipliers.


It is also important to consider the original design intention of the XC3S500E-4VQ100I when considering its application environment. This chip was designed to be highly configurable and easily upgradeable, which makes it an ideal choice for applications that require flexibility and scalability. Additionally, the chip is designed to be easily integrated into existing systems, making it a great choice for applications that require seamless integration.


When considering the future of the XC3S500E-4VQ100I, it is important to consider the possibilities for future upgrades and improvements. The chip is designed to be easily upgradeable, so it is possible to add new features and capabilities to the chip. Additionally, the chip is designed to be compatible with a variety of different technologies, so it is possible to integrate new technologies into the chip.


Finally, it is important to consider the product description and specific design requirements of the XC3S500E-4VQ100I when considering its application environment. The product description should include information about the chip's features and capabilities, as well as the specific requirements for its use. Additionally, it is important to consider actual case studies and precautions when considering the application environment of the XC3S500E-4VQ100I. By understanding the chip's capabilities and limitations, it is possible to ensure that the chip is used in the most effective and efficient manner possible.


In conclusion, the XC3S500E-4VQ100I is a powerful and reliable chip that is designed to be used in a variety of applications. It is capable of supporting a variety of different technologies, and it is designed to be easily upgradeable and integrated into existing systems. When considering the application environment of the XC3S500E-4VQ100I, it is important to consider the specific technologies that are needed, the original design intention of the chip, and the possibilities for future upgrades and improvements. Additionally, it is important to consider the product description and specific design requirements of the chip, as well as actual case studies and precautions.



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