AMD Xilinx
XC3S500E-4CP132C
XC3S500E-4CP132C ECAD Model
XC3S500E-4CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 10476 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 1164 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1164 CLBS, 500000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S500E-4CP132C Datasheet Download
XC3S500E-4CP132C Overview
The XC3S500E-4CP132C chip model is a high-performance, low-cost Field Programmable Gate Array (FPGA) designed and manufactured by Xilinx. This model is ideal for applications requiring high-performance digital signal processing, embedded processing and image processing. It is a versatile device that can be programmed to perform a wide range of tasks and can be used in a variety of applications.
The XC3S500E-4CP132C chip model is based on the Virtex-4 family of FPGAs, which is designed to meet the demands of modern high-performance applications. It is capable of processing data at rates of up to 500 MHz, and is equipped with 4,132 logic cells, making it capable of handling complex tasks. The chip is also equipped with four PowerPC 440 processors, allowing for fast and efficient parallel processing. Additionally, the chip model has a wide range of I/O ports and peripherals, making it suitable for use in a variety of applications.
The XC3S500E-4CP132C chip model is programmed using the hardware description language (HDL) which is a language designed to create digital systems. This language allows the user to create, modify and debug hardware designs. The chip model is also equipped with a range of features which make it suitable for use in a variety of applications. These features include a wide range of memory, a high-speed bus, and a range of I/O ports and peripherals.
The XC3S500E-4CP132C chip model is an ideal choice for applications requiring high-performance digital signal processing, embedded processing and image processing. It is also suitable for applications requiring fast and efficient parallel processing. The chip model is also capable of handling complex tasks and is suitable for use in a variety of applications.
The demand for the XC3S500E-4CP132C chip model is expected to increase in the future as more applications are developed which require high-performance processing and image processing. As the demand for this chip model increases, more companies are likely to invest in the development of new applications which require the use of this chip model.
When designing with the XC3S500E-4CP132C chip model, it is important to consider the specific design requirements of the application. It is also important to consider the power consumption and the cost of the device. Additionally, it is important to consider the compatibility of the chip model with other FPGA devices and the availability of the necessary tools and software.
In conclusion, the XC3S500E-4CP132C chip model is a versatile and highly capable FPGA which is suitable for use in a variety of applications. It is capable of handling complex tasks and is equipped with a range of features which make it suitable for use in high-performance digital signal processing, embedded processing and image processing applications. The demand for this chip model is expected to increase in the future, as more applications are developed which require its use. When designing with the XC3S500E-4CP132C chip model, it is important to consider the specific design requirements of the application, the power consumption and the cost of the device. Additionally, it is important to consider the compatibility of the chip model with other FPGA devices and the availability of the necessary tools and software.
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3,084 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $28.1753 | $28.1753 |
| 10+ | $27.8723 | $278.7232 |
| 100+ | $26.3575 | $2,635.7520 |
| 1000+ | $24.8427 | $12,421.3600 |
| 10000+ | $22.7220 | $22,722.0000 |
| The price is for reference only, please refer to the actual quotation! | ||