XC3S5000-5FGG676C
XC3S5000-5FGG676C
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AMD Xilinx

XC3S5000-5FGG676C


XC3S5000-5FGG676C
F20-XC3S5000-5FGG676C
Active
IC FPGA 489 I/O 676FBGA
676-FBGA (27x27)

XC3S5000-5FGG676C ECAD Model


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XC3S5000-5FGG676C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3
Package Tray
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of I/O 489
Number of Gates 5000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC3S5000

XC3S5000-5FGG676C Datasheet Download


XC3S5000-5FGG676C Overview



The XC3S5000-5FGG676C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range, low-cost FPGA, suitable for a wide range of applications. It has 5,400,000 system gates and 576 I/O pins, and is fabricated using a 0.18um CMOS process.


The chip has a wide range of features and capabilities, including: high-speed serial transceivers, up to 200MHz; differential and single-ended I/O support; high-speed memory interfaces; on-chip clock generation and management; and advanced power management. It also has a wide range of I/O support, including LVDS, LVPECL, SSTL, and HSTL.


The XC3S5000-5FGG676C can be used in a wide range of applications, including digital signal processing, embedded systems, communications systems, and automotive systems. It is ideal for applications that require high performance, low power consumption, and flexibility.


The XC3S5000-5FGG676C is an excellent choice for any application that requires a low-cost, high-performance FPGA. Its wide range of features and capabilities make it a versatile and reliable solution for any project.



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Pricing (USD)

QTY Unit Price Ext Price
1+ $0.7440 $0.7440
10+ $0.7360 $7.3600
100+ $0.6960 $69.6000
1000+ $0.6560 $328.0000
10000+ $0.6000 $600.0000
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