AMD Xilinx
XC3S5000-5FGG1156C
XC3S5000-5FGG1156C ECAD Model
XC3S5000-5FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 784 | |
| Number of Outputs | 784 | |
| Number of Logic Cells | 74880 | |
| Number of Equivalent Gates | 5000000 | |
| Number of CLBs | 8320 | |
| Combinatorial Delay of a CLB-Max | 530 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8320 CLBS, 5000000 GATES | |
| Clock Frequency-Max | 725 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3S5000-5FGG1156C Datasheet Download
XC3S5000-5FGG1156C Overview
The chip model XC3S5000-5FGG1156C is a powerful, high-performance FPGA device from Xilinx. It is designed to meet the needs of high-speed computing and signal processing applications. This model is ideal for embedded systems and communications applications, as it is capable of supporting a wide range of protocols, including Ethernet, USB, and PCI Express.
The chip model XC3S5000-5FGG1156C is designed to provide a high level of flexibility, allowing for customization of the design to suit the needs of the application. It also provides a high level of performance, with a maximum operating frequency of up to 500MHz. This model also offers a wide range of I/O options, allowing for the connection of multiple peripherals and devices.
The chip model XC3S5000-5FGG1156C has been designed to be highly reliable and efficient, making it ideal for a wide range of applications. It is also designed to be highly scalable, allowing for future upgrades and modifications as needed. This model is also designed to be highly compatible with a wide range of communication systems, making it suitable for applications in advanced communication systems.
In terms of industry trends, the chip model XC3S5000-5FGG1156C is expected to remain in high demand in the future. This is due to its high level of performance, scalability, and compatibility with a wide range of communication systems. Additionally, its flexible design allows for customization of the design to meet the needs of the application. As such, it is expected that the demand for this model will continue to increase in the future.
The original design intention of the chip model XC3S5000-5FGG1156C was to provide a powerful, high-performance FPGA device that is capable of meeting the needs of high-speed computing and signal processing applications. This model has been designed to be highly reliable and efficient, as well as highly scalable and compatible with a wide range of communication systems. As such, it is possible that this model could be used in advanced communication systems in the future.
In terms of whether the application environment requires the support of new technologies, this depends on the specific technologies needed. However, the chip model XC3S5000-5FGG1156C is designed to provide a high level of flexibility, allowing for customization of the design to suit the needs of the application. This model is also designed to be highly scalable and compatible with a wide range of communication systems, making it suitable for applications in advanced communication systems. As such, it is possible that this model could be used in advanced communication systems in the future.
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5,302 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $126.4800 | $126.4800 |
| 10+ | $125.1200 | $1,251.2000 |
| 100+ | $118.3200 | $11,832.0000 |
| 1000+ | $111.5200 | $55,760.0000 |
| 10000+ | $102.0000 | $102,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||