XC3S5000-5FG900C

The XC3S5000-5FG900C is a Field Programmable Gate Array (FPGA) chip from Xilinx Corporation. It is based on the Virtex-5 FPGA architecture and is manufactured using a 65nm process technology. The chip has a total of 900k logic cells and 5.5Mbits of block RAM. It also features over 1700 digital signal processing (DSP) slices and up to 576 I/O pins.

The chip is designed to provide high performance, low power and high integration for a variety of applications. It is suitable for a wide range of applications such as embedded systems, communications, video and imaging, automotive, industrial control and medical equipment.

The chip features a wide range of features that make it suitable for many applications. It has an integrated clock management unit (CMU) for clock management and synchronization, a low-power, low-latency DSP48E1 DSP block for signal processing, and an integrated RocketIO transceiver for high-speed communication. It also has a dedicated power supply for low-power operation and a wide range of I/O connectors for connecting to external devices.

The XC3S5000-5FG900C is an ideal choice for applications that require high performance, low power, and high integration. It is suitable for a wide range of applications such as embedded systems, communications, video and imaging, automotive, industrial control and medical equipment.