AMD Xilinx
XC3S5000-5FG1156I
XC3S5000-5FG1156I ECAD Model
XC3S5000-5FG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 784 | |
| Number of Outputs | 784 | |
| Number of Logic Cells | 74880 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S5000-5FG1156I Datasheet Download
XC3S5000-5FG1156I Overview
The XC3S5000-5FG1156I chip model is a cutting-edge technology developed by Xilinx, a leader in the semiconductor industry. It is a Field Programmable Gate Array (FPGA) that is designed to meet the needs of high-performance embedded systems. This chip model is capable of achieving high-speed data processing, low power consumption, and excellent reliability.
The XC3S5000-5FG1156I chip model is designed with a high-performance architecture that enables it to handle complex tasks with ease. It has an impressive array of features that make it ideal for applications such as high-speed signal processing, image processing, and video processing. Additionally, the chip model is designed to be compatible with a wide range of communication protocols, making it suitable for use in a variety of advanced communication systems.
The XC3S5000-5FG1156I chip model is designed to be highly customizable and upgradeable. It is capable of being adapted to different application environments and can be upgraded with new features and technologies as needed. This makes it a great choice for applications that require a high degree of flexibility and scalability. Additionally, the chip model is designed to be highly reliable, making it suitable for use in mission-critical applications.
In terms of industry trends, the XC3S5000-5FG1156I chip model is a great choice for applications that require high-performance embedded systems. It is capable of meeting the needs of a wide range of applications, making it a great choice for those looking to stay ahead of the curve and develop cutting-edge technologies. Additionally, the chip model is designed to be highly reliable, making it suitable for use in mission-critical applications.
In terms of the product description, the XC3S5000-5FG1156I chip model is a high-performance FPGA that is designed to meet the needs of high-performance embedded systems. It is capable of achieving high-speed data processing, low power consumption, and excellent reliability. Additionally, the chip model is designed to be compatible with a wide range of communication protocols, making it suitable for use in a variety of advanced communication systems.
In terms of actual case studies and precautions, it is important to note that the XC3S5000-5FG1156I chip model is designed to be highly customizable and upgradeable. It is capable of being adapted to different application environments and can be upgraded with new features and technologies as needed. Additionally, it is important to ensure that the chip model is used in the correct application environment and that the correct protocols are used for communication.
In conclusion, the XC3S5000-5FG1156I chip model is an excellent choice for applications that require high-performance embedded systems. It is capable of achieving high-speed data processing, low power consumption, and excellent reliability. Additionally, the chip model is designed to be highly customizable and upgradeable, making it suitable for use in a variety of advanced communication systems. It is important to ensure that the chip model is used in the correct application environment and that the correct protocols are used for communication.
You May Also Be Interested In
2,315 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $126.4800 | $126.4800 |
| 10+ | $125.1200 | $1,251.2000 |
| 100+ | $118.3200 | $11,832.0000 |
| 1000+ | $111.5200 | $55,760.0000 |
| 10000+ | $102.0000 | $102,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||