XC3S5000-4FGG900C
XC3S5000-4FGG900C
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AMD Xilinx

XC3S5000-4FGG900C


XC3S5000-4FGG900C
F20-XC3S5000-4FGG900C
Active
IC FPGA 633 I/O 900FBGA
900-FBGA (31x31)

XC3S5000-4FGG900C ECAD Model


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XC3S5000-4FGG900C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3
Package Tray
Number of LABs/CLBs 8320
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of I/O 633
Number of Gates 5000000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31x31)
Base Product Number XC3S5000

XC3S5000-4FGG900C Datasheet Download


XC3S5000-4FGG900C Overview



The XC3S5000-4FGG900C is a Field Programmable Gate Array (FPGA) chip from Xilinx, Inc. It is a high-performance, low-power device that is suitable for a wide range of applications.


The XC3S5000-4FGG900C has a total of 4,000 logic cells and 4,000 flip-flops, with a total of 4,000 dedicated I/O pins. It also has a wide range of features, including two PowerPC 440 hard processor cores, two full-speed PCI Express ports, two high-speed transceivers, and two dedicated clock management tiles. The chip is fabricated with a low-power 90nm process, which allows for higher performance at lower power consumption.


The XC3S5000-4FGG900C is suitable for a wide range of applications, including embedded systems, communications, networking, and industrial automation. It is also well suited for applications such as digital signal processing, image processing, and video processing.


Overall, the XC3S5000-4FGG900C is a powerful and versatile FPGA chip from Xilinx, Inc. It provides high performance and low power consumption, making it suitable for a wide range of applications.



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Unit Price: $987.5783
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Pricing (USD)

QTY Unit Price Ext Price
1+ $918.4478 $918.4478
10+ $908.5720 $9,085.7204
100+ $859.1931 $85,919.3121
1000+ $809.8142 $404,907.1030
10000+ $740.6837 $740,683.7250
The price is for reference only, please refer to the actual quotation!

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