XC3S5000-4FGG676I

The XC3S5000-4FGG676I is a Field Programmable Gate Array (FPGA) chip model from Xilinx. It has a Spartan-3E architecture and is designed for high-performance applications. It has a capacity of 5 million system gates, 4,096 logic cells, and 676 I/O pins. The chip has a power consumption of 2.5W. It is fabricated using a 0.13-micron process technology and is packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA).

The XC3S5000-4FGG676I is ideal for a variety of applications, including embedded systems, communications, industrial automation, medical imaging, and automotive. It has features such as high-speed transceivers, clock management tiles, and embedded memory blocks. It also supports a wide range of I/O standards, including LVDS, LVPECL, and PCI Express.

The chip also has a range of built-in features, such as an integrated PowerPC processor, embedded memory blocks, and clock management tiles. It also has a range of configurable options, including clock frequency, I/O voltage levels, and I/O standards.

Overall, the XC3S5000-4FGG676I is a powerful FPGA chip that is suitable for a wide range of applications. It has a large capacity and a range of built-in features, making it an ideal choice for high-performance applications.